{"id":2156,"date":"2018-10-28T09:35:00","date_gmt":"2018-10-28T08:35:00","guid":{"rendered":"https:\/\/ap-s.makeasmile-media.de\/?p=2156"},"modified":"2023-04-05T09:35:13","modified_gmt":"2023-04-05T07:35:13","slug":"diversity-and-multifunctionality-await-visitors-at-aps-booth-621-hall-a4-at-semicon-europe-2018","status":"publish","type":"post","link":"https:\/\/www.ap-s.de\/en\/diversity-and-multifunctionality-await-visitors-at-aps-booth-621-hall-a4-at-semicon-europa-2018\/","title":{"rendered":"Diversity and multifunctionality await visitors at the AP&amp;S booth 621\/hall A4 at Semicon Europa 2018"},"content":{"rendered":"<p class=\"wp-block-paragraph\">From 13 to 16 November 2018 Semicon Europa, the leading trade fair for the European semiconductor market, will take place in Munich as part of electronica. AP&amp;S will be exhibiting this year again. In addition to a variety of technological highlights, the company as a whole will be in focus this time.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">&nbsp;\"We want to offer our visitors a trade fair experience, that gives them an extensive insight into AP&amp;S. Our products and services are versatile, the current company developments as well. We are currently investing 3.5 million euros in the construction of a new clean room and an additional production hall at the headquarters in Donaueschingen. This investment brings significant benefits to our customers, which of course will be a topic. Furthermore, the presence in Munich gives us the opportunity to celebrate our this year's award as Top 100 Innovator together with our customers,\" explains Tobias Bausch, Director Sales &amp; Marketing at AP&amp;S.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">For the first time the new AP&amp;S wet process tool TeraStep\u00ae will be presented. The MULTI-TOOL convinces with its multifunctionality, as it processes 12'' and 8'' wafers, double stacked and extra thin wafers, chemistry and solvents as well as different contamination types.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Endpoint detection is the company's new key feature for single wafer etch processing. The Spin-Step\u00ae tools equipped with this system, offer improved process stability, reproducibility, optimum process time and enable process media to be used in reclaim.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Predictive maintenance and fab-planning 4.0 are brought to the market by the versatile AP&amp;S Augmented Reality solution. With customer benefit in focus, it offers: optimized fab planning; solution-oriented construction process; time and cost savings and scheduled spare parts exchange. This innovation will also be presented at the Fab Management Forum on Tuesday 13th November at 15:10.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Another AP&amp;S presentation with the title \"UBM Metallization Technology for advanced semiconductor devices\" will be taking place in the TechLonge on Thursday 15th November at 11:45. Here the audience will get to know the basic aspects, benefits and crucial parameters of a successful e-less process.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Requests for a meeting at SEMICON Europa can be sent to&nbsp;<a href=\"mailto:sales@ap-s.de\">sales@ap-s.de<\/a><\/p>\n\n\n\n<p class=\"wp-block-paragraph\">To read this news in German, please click&nbsp;<a href=\"https:\/\/www.ap-s.de\/en\/fileadmin\/user_upload\/content\/news\/pdfs\/ap_s_at_the_semicon_europe_2018-pdf\/\" target=\"_blank\" rel=\"noreferrer noopener\">here<\/a>.<\/p>","protected":false},"excerpt":{"rendered":"<p>From 13 to 16 November 2018 Semicon Europa, the leading trade fair for the European semiconductor market, will take place in Munich as part of electronica. AP&amp;S will be exhibiting this year again. In addition to a variety of technological highlights, the company as a whole will be in focus this time. &nbsp;&#8222;We want to [&hellip;]<\/p>\n","protected":false},"author":5,"featured_media":2983,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_et_pb_use_builder":"","_et_pb_old_content":"","_et_gb_content_width":"","footnotes":""},"categories":[223],"tags":[53],"class_list":["post-2156","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-semicon-europa"],"acf":[],"publishpress_future_workflow_manual_trigger":{"enabledWorkflows":[]},"_links":{"self":[{"href":"https:\/\/www.ap-s.de\/en\/wp-json\/wp\/v2\/posts\/2156","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.ap-s.de\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.ap-s.de\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.ap-s.de\/en\/wp-json\/wp\/v2\/users\/5"}],"replies":[{"embeddable":true,"href":"https:\/\/www.ap-s.de\/en\/wp-json\/wp\/v2\/comments?post=2156"}],"version-history":[{"count":0,"href":"https:\/\/www.ap-s.de\/en\/wp-json\/wp\/v2\/posts\/2156\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.ap-s.de\/en\/wp-json\/wp\/v2\/media\/2983"}],"wp:attachment":[{"href":"https:\/\/www.ap-s.de\/en\/wp-json\/wp\/v2\/media?parent=2156"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.ap-s.de\/en\/wp-json\/wp\/v2\/categories?post=2156"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.ap-s.de\/en\/wp-json\/wp\/v2\/tags?post=2156"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}