Single wafer processing

horizontal wafer handling

Single Wafer Processing

The AP&S single wafer solutions are the right choice for you, when high precision processes with high uniformity, high level of repeatability and significantly precise process control are required. The AP&S single wafer processing portfolio covers a variety of processes for the semiconductor and MEMS production chain: cleaning, drying, etching, metal etching, PR strip and metal lift-off. Our equipment for horizontal wafer handling is able to process all standard sizes of substrates: 100mm, 125mm, 150mm, 200mm and 300mm. The AP&S in-house laboratory, called Demo Center, offers you a wide spectrum of single wafer process demonstrations.

Products

SINGLE WAFER PROCESSING

SPINSTEP
FLEX LINE

more

SPINETCHER
SPE 200

more

SPINLIFT-OFF

more

SPINMASK

more

SPINMETAL

more

SPINRCA

more

SPINSCRUBBER 

more

Single Wafer Processing

SpinStep Flex Line

Modular system SpinStep Flexline has been specially designed for a flexible combination of different processes like etching, cleaning, lift-off and developing.
Main Benefits
  • Optimized CoC by low chemical and water consumption
  • Maximum flexibility through a modular design
  • Highest reliability achieved by advanced process control
  • Comfortable handling: different processes are possible in one bowl
  • A switch between different wafer sizes is very easy to handle via our smart chuck changing system 
  • Tool demonstration in the AP&S Demo Center is available
Wafer sizes up to 12”
Substrates

Wafers, MEMS, optoelectronics, photomasks, up to 9” and square substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes

Cleaning, Etching, Drying, Lift-off, Developing, Metal etching and customized applications

Important technical features
  • Easy to configure and flexibly upgradeable because of the modular design
  • Optimized footprint, easy move-in procedure
  • No expensive space for our mini chemical management system within the cleanroom is required, as this can be positioned outside
  • From manual single-chamber to 1 or 2 chamber with robot handling system 
  • Wafer loading out of open cassette/ SMIF or FOUP

Single Wafer Processing

SpinEtcher

Proven wet process tool with endpoint detection for FEOL and BEOL processes.
Main Benefits
  • Optimized CoC by low chemical and water consumption
  • Endpoint detection for highest reliability and process control:

           1. Less over-processing time for complete layer etching needed (i.e. over-etching)

           2. Less undercut / attack on other layers

           3. Stable wafer-to-wafer uniformity

           4. Substantial reduction of chemical consumption 

  • Process safety corresponding to highest safety levels for chemicals
  • A switch between different wafer sizes is very easy to handle via our smart chuck changing system
  • Up to 5 media in one process bowl
  • Thin wafer handling
  • Tool demonstration in the AP&S Demo Center is available
Wafer sizes up to 12”
Substrates

Wafers, MEMS, optoelectronics, photomasks, up to 9” and square substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes

FEOL etching, BEOL etching and cleaning, Wafer thinning, Stress relief, Film and damage removal

Important technical features
  • Open cassette, SMIF-pod, FOUP
  • Easy to configure and flexibly upgradeable because of the modular design
  • Maximum safety for workers and equipment according to highest safety standards
  • Optimized footprint, easy move-in procedure
  • No expensive space for our mini chemical management system within the cleanroom is required, as this can be positioned outside

Single Wafer Processing

SpinLift-off

AP&S unique metal lift-off solution using DMSO and MegaSonic.
Main Benefits
  • Unique process performance, without impact on substrate and structures (without the use of high pressure) 
  • Complete metal layer lift-off within less 30 seconds
  • Cost efficient process: reclaim of process chemicals and of precious metal
  • Use of DMSO (dimethyl sulfoxide), an EH&S uncritical substance (EU & US)
  • Optimized process time with a positive impact to the overall throughput 
  • Tool demonstration in the AP&S Demo Center is available
Wafer sizes up to 12”
Substrates

Wafers, MEMS, optoelectronics, photomasks, up to 9” and square substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes
  • The AP&S metal lift-off solution is available for all types of metal layers, alloys and further protection layers used in the semiconductor industry like Au, Ag, AlCu, etc.
  • Metal Lift-off, PR-stripping
Important technical features
  • High safety for workers, environment and equipment
  • MegaSonic Agitation with field proven MegaSonic system
  • Effective DIW-rinse by optional high pressure DIW-nozzle
  • Solvent (e.g. IPA) rinse is available
  • Easy to configure and flexibly upgradeable because of the modular design
  • Optimized footprint, easy move-in procedure and hook-up

Single Wafer Processing

SpinMask

Proven tool for cleaning and etching of all common mask types.
Main Benefits
  • High flexibility and productivity due to a fast and easy change of mask sizes and chucks
  • Maximum flexibility in the setting of recipe parameters according to the different mask types
  • Optimized CoC by low chemical and water consumption
  • High-quality cleaning results, which lead to extended mask life
  • Extremely versatile as this wet process tool is suitable for a variety of masks and other substrates
  • Tool demonstration in the AP&S Demo Center is available
Mask sizes up to 9”
Substrates

Photomasks

Wafer material

Sapphire, Glass

Processes
  • Photomask cleaning, Photomask etching, Photomask resist strip
Important technical features 
  • Easy to configure and flexibly upgradeable because of the modular design
  • Maximum safety for workers, equipment and environment according to highest safety standards
  • Optimized footprint, easy move-in procedure and hook-up
  • No expensive space for our mini chemical management system within the cleanroom is required, as this can be positioned outside
  • Available versions: High pressure, SPM, SC1, dNH4OH, CO2 ionization, MegaSonic system (MegPie/MegaSonic nozzle)
Additional information:

The SpinMask single wafer tool is included in our online wet configurator. Here you can create your SpinMask tool according your specific requirements quickly and easily.  

Single Wafer Processing

SpinMetal

Metal etch tool using endpoint detection for high level process control.
Main Benefits   
  • Endpoint detection for highest reliability and process control:

           1. Less over-processing time for complete layer etching needed (i.e. over-etching)

           2. Less undercut / attack on other layers

           3. Stable wafer-to-wafer uniformity

           4. Substantial reduction of chemical consumption 

  • Up to 6 different etching media
  • Backside protection of wafers
  • Tool demonstration in the AP&S Demo Center is available
Wafer sizes up to 12”
Substrates

Wafers, MEMS, optoelectronics, photomasks, up to 9” and square substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes
  • The SpinMetal tool is suitable for metal stack etching for the following materials:     
    NickelChrome, Nickel, Copper, Cobalt, Aluminium, Gold, Titanium, Titanium Tungsten, Silver, Bismuth antimonide and other
  • Etching of several metal layers in one etching recipe with endpoint detection and control 
Important technical features
  • Easy to configure and flexibly upgradeable because of the modular design
  • Maximum safety for workers, equipment and environment according to highest safety standards
  • Optimized footprint, easy move-in procedure
  • No expensive space for our mini chemical management system within the cleanroom is required, as this can be positioned outside

Single Wafer Processing

SpinRCA

Cost-efficient single wafer cleaning tool with one or double chamber for high precision processes and uniformity.
Main Benefits
  • Optimized CoC by low chemical and water consumption
  • Offers all benefits of single wafer processing on a small footprint
  • Maximum flexibility and high productivity due to a fast and easy change of wafer sizes
  • Tool demonstration in the AP&S Demo Center is available
Wafer sizes up to 12”
Substrates

Wafers, MEMS, optoelectronics, square substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes

SC1, SC2, SPM, dHF

Important technical features
  • Easy to configure and flexibly upgradeable because of the modular design
  • Maximum safety for workers, equipment and environment according to highest safety standards
  • No expensive space for our mini chemical management system within the cleanroom is required, as this can be positioned outside
  • Available versions: MegaSonic system (MegPie/Meg nozzle)

Single Wafer Processing

SpinScrubber

Single wafer wet process tool for efficient particle removal.
Main Benefits
  • Optimized CoC by low chemical and water consumption: chemical recirculation and recycling included
  • Cleaning of the wafer’s front- and backside in parallel is possible
  • Thin wafer handling
  • Up to two different cleaning media in one process bowl
  • Tool demonstration in the AP&S Demo Center is available
Wafer size up to 12"
Substrates

Wafers, MEMS, optoelectronics, square substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes
  • Post grind
  • Post polish
  • Post CMP
  • Backside
  • Reclaim
  • Bevel clean
  • TSV cleaning
Important technical features
  • Easy to configure and flexibly upgradeable because of the modular design
  • Maximum safety for workers, equipment and environment according to highest safety standards
  • Optimized footprint, easy move-in procedure
  • No expensive space for our mini chemical management system within the cleanroom is required, as this can be positioned outside
  • Customer specific cleaning media on request

“Our aim is to cover the full range of wet process solutions, that are required across both front- and back-end production chains. Together with our customers we steadily develop new, outstanding processes, like e.g. the AP&S metal lift-off process, which is unique in today’s market.”

Alexandra Laufer-Müller, CEO

Contact

Sales Team

+49 771 8983-0