Semiconductor equipment -
efficient solutions for your wafer handling and more

PRODUCTS

PRODUCTS

Full range of wet process equipment

Whether a standard wet process tool or a customer-specific solution is required: Our modular product spectrum is tailored to your requirements!

The AP&S product range includes manual, semi-automated and fully automated wet process equipment for the semiconductor-, MEMS- and micro-structuring industries as well as the R&D sector.

Our extensive wet chemical process portfolio covers etch processes, surface conditioning, resist develop, resist strip, metal lift-off, metal etch, electroless metal deposition, wafer cleaning and drying applications.

We offer you wet process equipment for batch processing and single wafer processing as well as supporting semiconductor equipment like foup and box cleaner, laboratory equipment and chemical management systems. AP&S equipment is used in front-end-of-line (FEOL) and back-end-of-line (BEOL) processes.

The AP&S wet process equipment handles masks and wafers up to 12” / 300mm, including different wafer material like Si, SiC, GaN, GaAs, Sapphire, Glass and covering different material substrate thickness.

BATCH PROCESSING

High throughput, optimized process running costs, easy and comprehensive process control, consistent deposition results and processing of multiple wafers on both sides at once are the main characteristics of AP&S batch processing tools for the semiconductor devices and microelectromechanical systems (MEMS) manufacturing.

SINGLE WAFER PROCESSING

The AP&S single wafer solutions are the right choice for you, when high precision processes with high uniformity, high level of repeatability and significantly precise process control are required.

SUPPORTING EQUIPMENT

To ensure efficient wet processes in our customers’ semiconductor fabs is our primary goal.

vertical wafer handling

BATCH PROCESSING

High throughput, optimized process running costs, easy and comprehensive process control, consistent deposition results and processing of multiple wafers on both sides at once are the main characteristics of AP&S batch processing tools for the semiconductor devices and microelectromechanical systems (MEMS) manufacturing. The AP&S batch processing portfolio includes basic manual wet benches for laboratories or R&D purposes as well as fully-automatic high-end technology benches for high volume production. Due to the perfectly tuned interaction between our product design, automation and required chemicals our wet process solutions for batch processing offer process reliability, optimized process times, cost-efficiency and highest flexibility for the customer. The AP&S wet benches perform cleaning, drying, etching, metal etching, electroless plating, PR strip and metal lift-off processes for wafers up to 12” and masks.

Manual Wet Bench

Manual wet bench with a high level of process capabilities on a small footprint.

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Standalone Dryer

Efficient drying tool for wafers up to 300mm, thin wafers, ICs, MEMS, LED, photo masks and glass substrates

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Twin Step

Semi-automated wet bench for wafers up to 300mm with two process tanks.

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MultiStep

Semi-automated wet bench for wafers up to 200mm with a small footprint and a wide range of configuration options.

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GigaStep

Semi-automated modular, compact wet bench for wafers up to 200mm including all necessary process steps

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TeraStep

Innovative, fully automated platform for 300mm wafers, including multi wafer-thickness processing

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A-Series

Fully automated high throughput platform for wafers up to 8”.

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Vulcanio

Fully automated electroless plating tool for wafers up to 12”.

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horizontal wafer handling

SINGLE WAFER
PROCESSING

The AP&S single wafer solutions are the right choice for you, when high precision processes with high uniformity, high level of repeatability and significantly precise process control are required. The AP&S single wafer processing portfolio covers a variety of processes for the semiconductor and MEMS production chain: cleaning, drying, etching, metal etching, PR strip and metal lift-off. Our equipment for horizontal wafer handling is able to process all standard sizes of substrates: 100mm, 125mm, 150mm, 200mm and 300mm. The AP&S in-house laboratory, called Demo Center (Link zum Demo Center), offers you a wide spectrum of single wafer process demonstrations.

SpinStep Flex Line

Modular system SpinStep Flex line has been specially designed for a flexible combination of different processes like etching, cleaning, lift-off and developing.

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Spinetcher SPE 200

Proven wet process tool with endpoint detection for FEOL and BEOL processes.

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SpinLift-Off

AP&S unique metal lift-off solution using DMSO and MegaSonic.

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SpinMask

Proven tool for cleaning and etching of all common mask types.

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SpinMetal

Metal etch tool using endpoint detection for high level process control.

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SpinRCA

Cost-efficient single wafer cleaning tool with one or double chamber for high precision processes and uniformity.

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SpinScrubber

Single wafer wet process tool for efficient particle removal.

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SUPPORTING EQUIPMENT

To ensure efficient wet processes in our customers’ semiconductor fabs is our primary goal. Therefore, supporting equipment like foup and box cleaner, drying tools for wafers, laboratory equipment and chemical management solutions belong to our product range too. 

CleanStep Carrier Box

Efficient cleaning tool for all common types of carrier, boxes, SMIF-Pod’s and FOUP’s.

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CleanStep Parts

The CleanStep Parts is designed for etching and cleaning of PECVD and diffusion boats such as graphite boats, quartz parts, silicon carbide boats.

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CleanStep

The Vertical and Horizontal Tube Cleaner are specially designed for the cleaning of quartz tubes (different sizes).

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Chemical Management

The Chemical Management System handles acids, solvents and caustics used in the semiconductor-, MEMS- and micro-structuring industries as well as the R&D sector.

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Cleaning

Cleaning processes using ultra high purity chemistries require adequate pure equipment solutions with advanced surface and structural interaction. The hardware design focus is on the cleaning efficiency in variable structures at different aspect ratios.

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Etching

Etch processes for the different SC- materials require hardware optimized to the used high purity etch-chemistries. Low sigma variations of the etched structural dimensions from across chip, across wafer and wafer to wafer are the main target for wafer sizes up to 300mm. The effective removal of the etched materials in the structure is achieved by the optimized hydro-dynamic flow conditions in the equipment and the AP&S dryer concepts contribute to low particulate levels.

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PR Strip

After etching, the pattern is a permanent part of the top layer of the wafer. The resist that has acted as an etch barrier is removed from the surface.

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Developing

The pattern of the resist is developed by the chemical dissolution of the unpolymerized resist region. Development will form in the resist layer a pattern with the exact dimensions designated during the circuit design process.

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Metal Etching

Metal pattern etch technologies for Al, Ti, W and others. Complete removal of metals processes from device- or monitor- wafers for wafers up to 300mm diameter, using hardware tailored to the specific chemistries needed for each metal composite.

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E-Less Plating

Flip chip bonding is of increasing importance to further device miniaturization. Under-bump metallization is deposited in electro-less deposition technology on Al-alloy and Cu- substrates.

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Lift-Off

Metal-Lift-Off is a pattering process that eliminates the etch variation component. Wafers are processed through the development step, leaving a hole in the resist layer where a deposited layer is to be located on top of the resist and into the opening.

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Drying

Water surface tension creates a unique condition when wafers are pulled slowly through a water surface. The tension draws the water away from the surface, leaving it dry.

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Handling wafers and substrates within cleanrooms in the semiconductor fabs consists of numerous steps and critical processes, which have to be optimally coordinated in order to obtain high-quality results. Wet processing is certainly just one of these many steps, but one that decisively influences quality. AP&S makes a significant contribution by helping to ensure the stability and purity of wafers and substrates. Our wet process tools make sure that no residues or unwanted particles remain on wafer surfaces; we also prevent unintentional mixing of chemicals and in this way we create a clean basis for further processing.

Alexandra Läufer-Müller, CEO

Contact

Sales Team

+49 771 8983-0