Batch Processing

vertical wafer handling

WET BENCHES

High throughput, optimized process running costs, easy and comprehensive process control, consistent deposition results and processing of multiple wafers on both sides at once are the main characteristics of AP&S batch processing tools for the semiconductor devices and microelectromechanical systems (MEMS) manufacturing.

The AP&S batch processing portfolio includes basic manual wet benches for laboratories or R&D purposes as well as fully-automatic high-end technology benches for high volume production. Due to the perfectly tuned interaction between our product design, automation and required chemicals our wet process solutions for batch processing offer process reliability, optimized process times, cost-efficiency and highest flexibility for the customer.

The AP&S wet benches perform cleaning, drying, etching, metal etching, electroless plating, PR strip and metal lift-off processes for wafers up to 12” and masks.

PRODUCTS

BATCH PROCESSING

Manual
Wet Bench

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Standalone
Dryer

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TwinStep

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MultiStep

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GigaStep

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TeraStep

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A-Series 

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Vulcanio

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BATCH PROCESSING

Manual Wet Bench

Main Benefits / Important technical features:

  • Maximum flexibility through a modular design
  • Wide spectrum of customization and expansion options
  • Fast installation through a modular construction
  • Available as classic manual wet processor and as fume hood for higher safety standards
  • Material: available in cost-effective PP as well as in FM 4910 compatible material
  • Optimized footprint
Wafer sizes up to 12”
Substrates

Wafers and Masks

Material configuration:

Si, SiC, GaN, GaAs, Sapphire, Glass, Quartz masks

Processes
  • SC1
  • SC2
  • HF (in all concentrations)
  • DSP
  • KOH
  • SPM, TMAH, H3PO4
  • Solvent processes in a stainless steel version
  • Other on request

Batch Processing

Standalone Dryer

Main Benefits
  • One drying tool for different substrates up to 300mm: 25 or 50 wafer batches
  • Wafer thickness from 120 to 2000 µm without modification
  • Available as a stand-alone unit or integrated in a wet bench
  • Average process time 10 - 12 minutes
Wafer sizes up to 12”
Substrates

Wafers, MEMS, optoelectronics, photomasks, glass substrates

Material configuration:

Si, SiC, GaN, GaAs, Sapphire, Glass, others

Processes

Drying processes with IPA and N2

Important technical features
  • For high or low profile cassettes
  • Low IPA consumption: ≤ 30 ml / run
  • Ideally suited for thin wafers
  • Complies with: CE, SemiS2 and S8, FM 4910, SECS/GEM
  • Proven reliability:
    MTBF ≥ 800 h
    Uptime ≥ 97 %

Batch Processing

TwinStep

Main Benefits
  • Smart, modular construction – access needed from two sides only (front and back)
  • Comfortable handling and loading from front side above 1 rinse tank and 1 chemical tank on the back side
  • Superior reliability and process reproducibility with 97 % uptime
  • Robust wafer handling system for highest process safety
Wafer sizes up to 12”
Substrates

Wafers, MEMS, optoelectronics, photomasks, glass substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes

Various etching and cleaning processes

Important technical features
  • Optimized foot print (LxWxH): 900 x 1625 x 2000 mm
  • Complies with FM 4910, SEMI S2 and S8, SECS/GEM, in CE   
  • Process control via latest software technology: Sensor - software interface, suitable to in-house tracking system, extensive process documentation (consumption, media, temperature, cleaning cycles, end of run, log in), individual recipes

BATCH PROCESSING

MultiStep

Main Benefits
  • Smart, modular construction for comfortable and cost-efficient installation and maintenance as well as for high flexibility regarding upgrades
  • Multi wafer-size and  -thickness processing without tool modification
  • Superior reliability with an uptime of ≥ 97 %
Wafer sizes up to 8”
Substrates

Wafers, MEMS, optoelectronics, photomasks, glass substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes
  • Different wet cleaning processes
  • RCA
  • Pre-Diffusion
  • Pre Metal
  • Various etching processes, including oxide, nitride, poly crystalline, metals and silicides
Important technical features
  • Optimized footprint
  • Tool configuration is cost-efficiently adjustable according to future product / process changes and customer needs
  • Processes 2 x 25-wafer batches of 4” to 6” or 25 x 8” substrates
  • Complies with: FM 4910, SEMI S2 and S8, SECS, GEM, CE
  • Process control via latest software technology: Sensor - software interface, suitable to in-house tracking system, extensive process documentation (consumption, media, temperature, cleaning cycles, end of run, log in), individual recipes

Batch Processing

GigaStep

Main Benefits   
  • Smart, modular construction for comfortable and cost-efficient installation and maintenance as well as for high flexibility regarding upgrades
  • Multi wafer-size and  -thickness processing without tool modification
  • Superior reliability with an uptime of ≥ 97 %
Wafer sizes up to 8”
Substrates

Wafers, MEMS, optoelectronics, photomasks, glass substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes
  • Different wet cleaning processes
  • RCA
  • Solvent applications
  • Solvent applications combined in one tool with chemical applications
  • Pre-Diffusion
  • Pre Metal
  • Various etching processes, including oxide, nitride, poly crystalline, metals and silicides
Important technical features
  • Optimized footprint
  • Tool configuration is cost-efficiently adjustable according to future product / process changes and customer needs
  • Processes 2 x 25-wafer batches of 6” to 8” substrates
  • Complies with: FM 4910, SEMI S2 and S8, SECS, GEM, CE
  • Dry-in -> Dry-out or Dry-In -> Wet-out possible  
  • Process control via latest software technology: Sensor - software interface, suitable to in-house tracking system, extensive process documentation (consumption, media, temperature, cleaning cycles, end of run, log in), individual recipes

Batch Processing

TeraStep

Main Benefits
  • Different wafer sizes in one tool: 8”-12”
  • Multi wafer-thickness processing from 40 to 200µm/ TAIKO up to 2000 µm, double stacked wafers
  • Chemistry and solvents processes combined in one tool possible
  • Different contamination types in one tool possible
  • Different cassettes profiles (high or low)
Wafer sizes up to 12”
Substrates

Wafers

Wafer material

Si, GaN

Processes
  • Different wet cleaning processes
  • RCA
  • Solvent applications
  • Solvent applications combined in one tool with chemical applications
  • Pre-Diffusion
  • Pre Metal
  • Various etching processes, including oxide, nitride, poly crystalline, metals and silicides
Important technical features
  • FOUP system suitable (300mm)
  • SMIF system suitable (150, 200mm)
  • Processes 25/50 wafer batches
  • Automatic loading station incl. thin wafer handling
  • Dry-in -> Dry-out processing
  • Cassette buffer
  • Automatic loading by robot system or OHT possible
  • Complies with: FM 4910, SEMI S2 and S8, SECS, GEM, CE
  • Process control via latest software technology: Sensor - software interface, suitable to in-house tracking system, extensive process documentation (consumption, media, temperature, cleaning cycles, end of run, log in), individual recipes

Batch Processing

A-Series

Main Benefits
  • 100 wafer half-space processing for optimized bath and footprint utilization
  • High throughput by optimized process times and 100 wafer batch size
  • Comprehensive process and bath stability control and regulation for lower production costs and higher process reliability
Wafer size 6” or 8”
Substrates

Wafers

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes
  • Different wet cleaning processes
  • RCA
  • IMEC
  • Pre-Diffusion
  • Pre Metal
  • Various etching processes, including oxide, nitride, poly crystalline, metals and silicides
Important technical features
  • SMIF system suitable (150, 200mm)
  • Automatic loading by robot system or OHT possible
  • Designed for up to 100 wafer batches
  • Dry-in -> Dry-out processing
  • Complies with: FM 4910, SEMI S2 and S8, SECS, GEM, CE
  • Process control via latest software technology: Sensor - software interface, suitable to in-house tracking system, extensive process documentation (consumption, media, temperature, cleaning cycles, end of run, log in), individual recipes

Batch Processing

Vulcanio

Main Benefits
  • Specially designed and optimized for UBM (Under Bumping Metallization) of Aluminum or Copper pads (Nickel, Palladium, Immersion Gold)
  • Unique software and hardware features ensure exceptional deposition uniformity, bath longevity and unbeatable cost of ownership ratio
  • Process-tailored analyzers and optimized dosage provide comprehensive process control and highest reliability
Wafer size 6”, 8" and 12”
Substrates

Wafers

Wafer material

Si, SiC, GaN

Processes

Electroless UBM for AL and Cu pads (Ni, Pd, Au)

Important technical features
  • FOUP system suitable (300mm)
  • SMIF system suitable (150, 200mm)
  • Processes 25 or 50 wafer batches of 6” to 12” wafers
  • Operates with high- and low-profile cassettes
  • Dry-in -> Dry-out processing
  • Complies with: FM 4910, SEMI S2 and S8, SECS, GEM, CE
  • Process control via latest software technology: Sensor - software interface, suitable to in-house tracking system, extensive process documentation (consumption, media, temperature, cleaning cycles, end of run, log in), individual recipes

“Semiconductor manufacturing is constantly changing, which is a reason that AP&S invests heavily in the development of our portfolio. With AP&S the semiconductor and MEMS producers have a reliable supplier offering them everything they need for effective surface treatment of wafers and other substrates.”

Tobias Bausch, Director Sales & Marketing

Contact

Sales Team

+49 771 8983-0