Single wafer processing

horizontal wafer handling

Single Wafer Processing

The AP&S single wafer solutions are the right choice for you, when high precision processes with high uniformity, high level of repeatability and significantly precise process control are required. The AP&S single wafer processing portfolio covers a variety of processes for the semiconductor and MEMS production chain: cleaning, drying, etching, metal etching, PR strip and metal lift-off. Our equipment for horizontal wafer handling is able to process all standard sizes of substrates: 100mm, 125mm, 150mm, 200mm and 300mm. The AP&S in-house laboratory, called Demo Center, offers you a wide spectrum of single wafer process demonstrations.

Products

SINGLE WAFER PROCESSING

SPINSTEP
FLEX LINE

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SPINETCHER
SPE 200

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SPINLIFT-OFF

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SPINMASK

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SPINMETAL

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SPINRCA

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SPINSCRUBBER 

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Single Wafer Processing

SpinStep Flex Line

Main Benefits/ Important technical features:
  • Optimized CoC by low chemical and water consumption
  • Maximum flexibility through a modular design
  • Highest reliability achieved by advanced process control
  • Comfortable handling and easy size changing: different processes are possible in one bowl; a switch between different wafer sizes is very easy
  • Tool demonstration in the AP&S Demo Center is available 
Wafer sizes up to 12”
Substrates

Wafers, MEMS, optoelectronics, photomasks, up to 9” and square substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes

Cleaning, Etching, Drying, Lift-off, Developing and customized applications

Important technical features
  • Easy to configure and flexibly upgradeable because of the modular design
  • Optimized footprint, easy move-in procedure
  • No expensive space for chemical management system within the cleanroom is required, as this can be positioned outside.

Single Wafer Processing

SpinEtcher SPE 200

Main Benefits
  • Optimized CoC by low chemical and water consumption
  • Process safety corresponding to highest safety levels for chemicals
  • Endpoint detection for highest reliability and process control:

           1. Less over-processing time for complete layer etching needed 

           2. Less undercut / attack on other layers

           3. Stable wafer-to-wafer uniformity

           4. Substantial reduction of chemical consumption 

  • Comfortable handling and easy size changing, up to 5 media in one process bowl
  • Thin wafer handling
  • Tool demonstration in the AP&S Demo Center is available 
Wafer sizes up to 12”
Substrates

Wafers, MEMS, optoelectronics, photomasks, up to 9” and square substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes

FEOL etching, BEOL etching and cleaning, wafer thinning, stress relief, film and damage removal

Important technical features
  • Open cassette, SMIF-pod, FOUP
  • Easy to configure and flexibly upgradeable because of the modular design
  • Maximum safety for workers and equipment according to highest safety standards
  • Optimized footprint, easy move-in procedure
  • No expensive space for chemical management system within the cleanroom is required, as this can be positioned outside.

Single Wafer Processing

SpinLift-off

Main Benefits
  • Unique process performance, without impact on substrate and structures
  • Use of DMSO (dimethyl sulfoxide), an EH&S uncritical substance (EU & US)
  • Complete metal layer lift-off within less 30 seconds
  • Cost efficient process: reclaim of process chemicals and of precious metal
  • Optimized process time with a positive impact to the overall throughput
  • Tool demonstration in the AP&S Demo Center is available 
Wafer sizes up to 12”
Substrates

Wafers, MEMS, optoelectronics, photomasks, up to 9” and square substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes
  • The AP&S metal lift-off solution is available for all types of metal layers, alloys and further protection layers used in the semiconductor industry like Au, Ag, AlCu, etc.
  • Metal Lift-off, PR-stripping
Important technical features
  • High safety for workers, environment and equipment
  • MegaSonic Agitation with field proven MegaSonic system
  • Effective rinse by optional high pressure DIW
  • Solvent (e.g. IPA) rinse is available
  • Easy to configure and flexibly upgradeable because of the modular design
  • Optimized footprint, easy move-in procedure

Single Wafer Processing

SpinMask

Main Benefits
  • Maximum flexibility in the setting of recipe parameters according to the different mask types
  • High-quality cleaning results, which lead to extended mask life
  • Extremely versatile as this wet process tool is suitable for a variety of masks and other substrates
  • High flexibility and high productivity due to a fast and easy change of mask sizes
  • Optimized CoC by low chemical and water consumption
  • Tool demonstration in the AP&S Demo Center is available
Wafer sizes up to 9”
Substrates

Masks

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes
  • Photo mask cleaning, Photo mask etching, Photo mask resist strip
Important technical features 
  • Easy to configure and flexibly upgradeable because of the modular design
  • Maximum safety for workers, equipment and environment according to highest safety standards
  • Optimized footprint, easy move-in procedure
  • No expensive space for chemical management system within the cleanroom is required, as this can be positioned outside.
  • Available versions: High pressure, Single side brush, SPM, SC1, dNH4OH, CO2 ionization, MegaSonic system (MegPie/Meg nozzle)
Additional information:

The SpinMask single wafer tool is included in our online wet configurator. Here you can create your SpinMask tool according your specific requirements quickly and easily.  

Single Wafer Processing

SpinMetal

Main Benefits   
  • Endpoint detection for highest reliability and process control:

           1. Less over-processing time for complete layer etching needed

           2. Less undercut / attack on other layers

           3. Stable wafer-to-wafer uniformity

           4. Substantial reduction of chemical consumption 

  • Up to 6 different etching media
  • Backside protection of wafers
  • Tool demonstration in the AP&S Demo Center is available
Wafer sizes up to 12”
Substrates

Wafers, MEMS, optoelectronics, photomasks, up to 9” and square substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes

The SpinMetal tool is suitable for metal stack etching for the following materials: NickelChrome, Nickel, Copper, Cobalt, Aluminium, Gold, Titanium, TitaniumTungsten, Silver, Bismuth antimonide and other

Important technical features
  • Easy to configure and flexibly upgradeable because of the modular design
  • Maximum safety for workers, equipment and environment according to highest safety standards
  • Optimized footprint, easy move-in procedure
  • No expensive space for chemical management system within the cleanroom is required, as this can be positioned outside. 

Single Wafer Processing

SpinRCA

Main Benefits
  • Optimized CoC by low chemical and water consumption
  • Offers all benefits of single wafer processing on a small footprint
  • Maximum flexibility and high productivity due to a fast and easy change of wafer sizes
  • Tool demonstration in the AP&S Demo Center is available
Wafer sizes up to 12”
Substrates

Wafers, MEMS, optoelectronics, square substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes

SC1, SC2, SPM, dHF

Important technical features
  • Easy to configure and flexibly upgradeable because of the modular design
  • Maximum safety for workers, equipment and environment according to highest safety standards
  • No expensive space for chemical management system within the cleanroom is required, as this can be positioned outside.
  • Available versions: MegaSonic system (MegPie/Meg nozzle)

Single Wafer Processing

SpinScrubber

Main Benefits
  • Optimized CoC by low chemical and water consumption: chemical recirculation and recycling included
  • Cleaning of the wafer’s front- and backside in parallel is possible
  • Thin wafer handling
  • Up to two different cleaning media in one process bowl
  • Tool demonstration in the AP&S Demo Center is available
Wafer size up to 12"
Substrates

Wafers, MEMS, optoelectronics, square substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes
  • Post grind
  • Post polish
  • Post CMP
  • Backside
  • Reclaim
  • Bevel clean
  • TSV cleaning
Important technical features
  • Easy to configure and flexibly upgradeable because of the modular design
  • Maximum safety for workers, equipment and environment according to highest safety standards
  • Optimized footprint, easy move-in procedure
  • No expensive space for chemical management system within the cleanroom is required, as this can be positioned outside.
  • Customer specific cleaning media on request

“Our aim is to cover the full range of wet process solutions, that are required across both front- and back-end production chains. Together with our customers we steadily develop new, outstanding processes, like e.g. the AP&S metal lift-off process, which is unique in today’s market.”

Alexandra Laufer-Müller, CEO

Contact

Sales Team

+49 771 8983-0