Wet process applications overview

For semiconductor and also related industries AP&S has plenty of solutions to run stable and cost-effective cleaning, etching, plating or lift-off processes. With modular wet equipment platforms using different techniques (wet immersion, spin or spray process) AP&S covers the needs for different wet process applications.

At our demo process laboratory in Donaueschingen we can run spin process demonstrations with wafers, masks or other substrates.

Cleaning
• SC1
• TMAH/H2O2
• DSP
• EKC/ACT
• Ozone
• Scrubber
• Post CMP
• Megasonic
• Etc.
Etching
• DHF
• BOE
• HF 49%
• DHF/HCI
• KOH
• SiOetch
• PME
• P-Etch
• Etc.
Metal Etching
• Poly-Si
• Alu
• TiN
• Co
• CoSi
• Cu
• Etc.


PR Strip
• DHF
• SPM
• SOM
• Etc





Eless plating
• Nickel-Gold
• Nickel-Palladium
• Gold

Lift-off
• Au
• NiCr
• Co
• Etc.
Drying
• Marangoni
• Spin
• Hot air

Coating & Developing
• Postive resist
• Negative resist
• SU8

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The CleanStep Carrier Box significantly reducing the time required for carrier/FOUP cleaning and drying, delivers maximized productivity and superior technology by combining multiple work steps in one single tool.

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The SpinMask combines cleaning and drying of masks or other substrates of different cleaning applications with chemicals, integrated mega sonic system or brushes, easy handling, fully integrated process control and process monitoring.

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The fully automated Chemical Management System is designed to handle acids, solvents and caustics used in the semiconductor, micro mechanic and solar industries.