Wet process applications overview

wet process applications

AP&S offers innovative solutions for cleaning, etching, plating, lift-off, developing, drying and other wet processes. 

With a wide range of modular wet equipment using different techniques like wet immersion, spin or spray process, AP&S covers the specific needs of the semiconductor-, MEMS- and micro-structuring industries as well as the R&D sector.  

At the AP&S Demo Center, an in-house laboratory located at the German headquarters, we can run spin process demonstrations with wafers, masks or other substrates.

Cleaning
• SC1
• TMAH/H2O2
• DSP
• EKC/ACT
• Ozone
• Scrubber
• Post CMP
• Megasonic
• Etc.
Etching
• DHF
• BOE
• HF 49%
• DHF/HCI
• KOH
• SiO2 etch
• PME
• P-Etch
• Etc.
Metal Etching
• Poly-Si
• Al
• TiN
• Co
• CoSi
• Cu
• Etc.


PR Strip
• DHF
• SPM
• SOM
• Solvents
• Etc





Eless plating
• Palladium
• Nickel-Gold
• Nickel-Palladium
• Gold

Lift-off
• Au
• NiCr
• Co
• Etc.
Drying
• Marangoni
• Spin
• Hot N2 / Air

Coating & Developing
• Postive resist
• Negative resist
• SU8

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The CleanStep Carrier Box significantly reducing the time required for carrier/FOUP cleaning and drying, delivers maximized productivity and superior technology by combining multiple work steps in one single tool.

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The SpinMask combines cleaning and drying of masks or other substrates of different cleaning applications with chemicals, integrated mega sonic system or brushes, easy handling, fully integrated process control and process monitoring.

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The fully automated Chemical Management System is designed to handle acids, solvents and caustics used in the semiconductor, micro mechanic and solar industries.