Single Wafer Wet Solutions

The rapid transfer of research results into products, processes and services contributes significantly to the competitiveness of AP&S in the field of single wafer equipment. At the AP&S Demo Center in Donaueschingen, Germany we run spin process demonstrations with single wafer wet processes, photo mask cleaning and processes with other substrates to offer horizontal wafer processing tools, which perfectly meet our customer requirements.

etching
Etching & Metal Etch

coating
Coating & Developing

PR strip
PR Strip

lift-off
Lift-off

drying
Drying

cleaning
Cleaning

Contact

Oliver Pohl
Phone: +49 771 8983-155
E-mail

single wafer

SpinStep Flex Line

The modular, versatile single wafer wet system SpinStep is designed for single wafer etching, cleaning, lift-off, coating and developing.

  • Modular platform 
  • Optimized footprint
  • Maximum flexibility

Data Sheet SpinStep Flex Line

mask cleaner

SpinMask

Our tool for mask cleaning and etching processes. Suitable for masks and other substrates up to 9".

  • Piranha
  • Diluted Ammonium Hydroxide
  • High Pressure
  • Brush 

Data Sheet SpinMask

>> CONFIGURE YOUR SPINMASK

etching

SpinEtcher SPE 200

The SpinEtcher is our proved single wafer tool for FEOL and BEOL processes like: 

  • Roughness etching
  • Stress relief
  • Polishing
  • Film removal 

Data Sheet SpinEtcher SPE 200

single wafer

SpinScrubber

The SpinScrubber single wafer tool performs the following wet processes: 

  • Post grind
  • Post polish
  • Post CMP
  • Backside
  • Reclaim
  • Bevel clean
  • TSV cleaning

 

 

metal cleaner

SpinMetal

The SpinMetal tool is suitable for wet processes with the following materials: 

  • NickelChrome
  • Nickel
  • Copper
  • Cobalt
  • Aluminium
  • Gold
  • Titanium

 

 

etching

SpinLift-off

The AP&S metal lift-off solution is available for all types of metal layers, alloys and further protection layers used in the semiconductor industry like Au, Ag, AlCu, etc. 

  • Metal lift-off and resist removal
  • Superb solvent performance, without impact on substrate and structures
  • Use of DMSO (dimethyl sulfoxide), an EH&S uncritical substance (EU & US)
  • High safety for workers, environment and equipment
  • Optimized process time with an positive impact to the overall throughput

 

 

inject product configurator
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The CleanStep Carrier Box significantly reducing the time required for carrier/FOUP cleaning and drying, delivers maximized productivity and superior technology by combining multiple work steps in one single tool.

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The SpinMask combines cleaning and drying of masks or other substrates of different cleaning applications with chemicals, integrated mega sonic system or brushes, easy handling, fully integrated process control and process monitoring.

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The fully automated Chemical Management System is designed to handle acids, solvents and caustics used in the semiconductor, micro mechanic and solar industries.