Wet Bench Solutions

AP&S offers wet equipment platforms starting from basic manual wet benches on laboratory or R&D level up to fully-automatic high volume production and high-end technology tools. Depending on the wet cleaning or wet etching application, there are different standard features availble that can be covered in our modular wet bench solutions. Customization due to special application, wafer material or product design is our daily business.

Metal Etching

Eless Plating

PR Strip

Lift-off

Drying

Cleaning

Contact

Tobias Bausch
Phone: +49 771 8983-145
E-mail

Manual Wet Bench - AP&S International GmbH

Wet processor manual

Manual wet bench and manual wet process (MWP) equipment for various applications such as wafer cleaning, etching, stripping or developing.
Also available as fume hood.

Designed for substrates up to 12".

Data Sheet Wet processor manual

NID Dryer

Surface gradient IPA dryer based on Marangoni principle for up 12" wafers.
Available as stand-alone tool or integrated in a wet bench.
NID drying process evaluation with customers' substrates can be done at our partner IMS-Chips (Institut für Mikroelektronik) in Stuttgart.

Data Sheet NID dryer

Wet bench Station Twin Step - AP&S International GmbH

TwinStep

Semi-automated wet bench system for various applications like wafer cleaning, etching, stripping or developing. 

Designed for up to 50 wafers 12".

Data Sheet TwinStep

Wet bench solution Multi Step - AP&S International GmbH

MultiStep

Fully automated wet bench platform for various applications like cleaning, etching, stripping, developing etc.

Can be easily adapted to customer specific requirements.

Designed for up to 50 wafers 6" or 25 wafers 8".

Data Sheet MultiStep

Wet bench System Giga Step - AP&S International GmbH

GigaStep

Fully automated wet bench platform for various applications like cleaning, etching, stripping, developing etc.
This tool is also available as a 100 wafer half-space wet equipment for high volume prodcution.  

Can be easily adapted to customer specific requirements.

Designed for up to 100 wafers 8" or 50 wafers 12".

Data Sheet GigaStep

e-less plating tool Vulcanio - AP&S International GmbH

A-Series | Vulcanio

Fully automated high troughput platform for e-less plating and various wet process applications. This tool is also available as a 100 wafer half-space wet equipment for high volume prodcution.

Data Sheet Vulcanio

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The CleanStep Carrier Box significantly reducing the time required for carrier/FOUP cleaning and drying, delivers maximized productivity and superior technology by combining multiple work steps in one single tool.

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The SpinMask combines cleaning and drying of masks or other substrates of different cleaning applications with chemicals, integrated mega sonic system or brushes, easy handling, fully integrated process control and process monitoring.

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The fully automated Chemical Management System is designed to handle acids, solvents and caustics used in the semiconductor, micro mechanic and solar industries.