{"id":155,"date":"2022-10-14T14:15:00","date_gmt":"2022-10-14T12:15:00","guid":{"rendered":"https:\/\/ap-s.makeasmile-media.de\/?page_id=155"},"modified":"2026-10-16T08:34:21","modified_gmt":"2026-10-16T06:34:21","slug":"%e4%b8%bb%e9%a1%b5","status":"publish","type":"page","link":"https:\/\/www.ap-s.de\/zh\/","title":{"rendered":"\u4e3b\u9875"},"content":{"rendered":"

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arrows_custom_color=“#FFFFFF“ _builder_version=“4.27.9″ _module_preset=“default“ header_font_size=“66px“ body_font_size=“24px“ background_enable_image=“off“ custom_button=“on“ button_text_size=“14px“ button_text_color=“gcid-10e8a2b0-2d4b-42be-9ffa-7ef228a8c91b“ button_bg_color=“gcid-248f476c-3c45-42e5-9fb1-c88373881882″ button_border_width=“6px“ button_border_color=“gcid-248f476c-3c45-42e5-9fb1-c88373881882″ button_border_radius=“27px“ button_font=“hind-v16-latin-regular||||||||“ button_icon=“E||divi||400″ button_icon_placement=“left“ button_on_hover=“off“ text_orientation=“left“ custom_padding=“5vh||5vh||false|false“ custom_padding_tablet=“12vh||10vh||false|false“ custom_padding_phone=“9vh||7vh||false|false“ custom_padding_last_edited=“on|tablet“ animation_style=“fade“ auto=“on“ auto_speed=“10000″ hover_transition_duration=“1200ms“ header_font_size_tablet=“48px“ header_font_size_phone=“40px“ header_font_size_last_edited=“on|phone“ body_font_size_tablet=“20px“ body_font_size_phone=“18px“ body_font_size_last_edited=“on|desktop“ custom_css_slide_description=“||“ border_radii=“off|400px|||400px“ border_radii_tablet=“off|400px|||400px“ border_radii_phone=“off|0px|||0px“ border_radii_last_edited=“on|phone“ box_shadow_style=“preset1″ global_colors_info=“{%22gcid-248f476c-3c45-42e5-9fb1-c88373881882%22:%91%22button_bg_color%22,%22button_border_color%22%93,%22gcid-10e8a2b0-2d4b-42be-9ffa-7ef228a8c91b%22:%91%22button_text_color%22%93}“][et_pb_slide heading=“#SEMICON Europa“ button_text=“Mehr Informationen“ button_link=“https:\/\/www.semiconeuropa.org\/“ use_bg_overlay=“on“ _builder_version=“4.27.9″ _module_preset=“default“ background_enable_color=“off“ background_image=“https:\/\/www.ap-s.de\/wp-content\/uploads\/2026\/10\/aps_semicon_europa_2026.jpg“ background_enable_image=“on“ link_option_url=“https:\/\/www.semiconeuropa.org\/“ hover_enabled=“0″ global_colors_info=“{}“ sticky_transition=“on“ title_text=“aps_semicon_europa_2026″ sticky_enabled=“0″]<\/p>\n

Innovative Nassprozessl\u00f6sungen LIVE erleben!<\/p>\n

Entdecken Sie auf der SEMICON Europa unsere neuesten L\u00f6sungen f\u00fcr Cleaning, Etching, Plating und Digitalisierung.<\/p>\n

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10.\u201313. November 2026 | Stand B 1656<\/strong><\/p>\n<\/div>\n

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[\/et_pb_slide][et_pb_slide heading=“#Standort Dresden“ button_text=“Mehr Informationen“ button_link=“@ET-DC@eyJkeW5hbWljIjp0cnVlLCJjb250ZW50IjoicG9zdF9saW5rX3VybF9wb3N0Iiwic2V0dGluZ3MiOnsicG9zdF9pZCI6IjIzMjIyNjEzIn19@“ use_bg_overlay=“on“ _builder_version=“4.27.5″ _dynamic_attributes=“button_link,link_option_url“ _module_preset=“default“ background_enable_color=“off“ background_image=“https:\/\/www.ap-s.de\/wp-content\/uploads\/2026\/06\/aps_dresden_blau.jpg“ background_enable_image=“on“ link_option_url=“@ET-DC@eyJkeW5hbWljIjp0cnVlLCJjb250ZW50IjoicG9zdF9saW5rX3VybF9wb3N0Iiwic2V0dGluZ3MiOnsicG9zdF9pZCI6IjIzMjIyNjEzIn19@“ global_colors_info=“{}“ sticky_transition=“on“]<\/p>\n

AP&S w\u00e4chst weiter: Neuer Standort in Dresden schafft Raum f\u00fcr Academy, Konsignationslager und Kundenn\u00e4he.<\/p>\n

Der neue Firmensitz befindet sich am Manfred-von-Ardenne-Ring 13 und liegt nur rund 250 Meter vom bisherigen Standort entfernt. Damit bleibt AP&S seinen Kunden, Partnern und Mitarbeitenden in der Region weiterhin unmittelbar verbunden.<\/p>\n

Mit dem Umzug vergr\u00f6\u00dfert AP&S seine r\u00e4umlichen Kapazit\u00e4ten deutlich.<\/p>\n

[\/et_pb_slide][et_pb_slide heading=“#Unsere Boxenreiniger“ button_text=“Mehr Informationen“ button_link=“https:\/\/www.ap-s.de\/produkte\/#ProduktionsunterstuetzendesEquipment“ use_bg_overlay=“on“ _builder_version=“4.27.5″ _module_preset=“default“ background_enable_color=“off“ background_image=“https:\/\/www.ap-s.de\/wp-content\/uploads\/2024\/11\/aps_unternehmen_cleaner-special_01.jpg“ background_enable_image=“on“ link_option_url=“https:\/\/www.ap-s.de\/produkte\/#ProduktionsunterstuetzendesEquipment“ global_colors_info=“{}“ sticky_transition=“on“]<\/p>\n

H\u00f6chster Reinheitsstandard f\u00fcr sichere Prozessketten in der Halbleiterfertigung<\/span><\/p>\n

Mit hoher Reinigungsleistung, geringem Ressourcenverbrauch und kompakter Bauweise setzen die AP&S-Systeme Ma\u00dfst\u00e4be in ihrer Klasse. Multi-Box-Reinigung, ein innovatives D\u00fcsen- und partikelfreies Pumpensystem sowie das intuitive Halterungskonzept erm\u00f6glichen maximale Effizienz auf kleinstem Raum. Die \u201eThrough-the-Wall\u201c-Installation minimiert zus\u00e4tzlich den Reinraumbedarf und sorgt f\u00fcr ein optimiertes Anlagenlayout.<\/span><\/p>\n

[\/et_pb_slide][et_pb_slide heading=“#productronica Award“ button_text=“Mehr Informationen“ button_link=“@ET-DC@eyJkeW5hbWljIjp0cnVlLCJjb250ZW50IjoicG9zdF9saW5rX3VybF9wb3N0Iiwic2V0dGluZ3MiOnsicG9zdF9pZCI6IjIzMjIyMjI5In19@“ use_bg_overlay=“on“ _builder_version=“4.27.5″ _dynamic_attributes=“button_link,link_option_url“ _module_preset=“default“ background_enable_color=“off“ background_image=“https:\/\/www.ap-s.de\/wp-content\/uploads\/2025\/12\/aps_productronica_award_2025_blau.jpg“ background_enable_image=“on“ background_position=“top_center“ link_option_url=“@ET-DC@eyJkeW5hbWljIjp0cnVlLCJjb250ZW50IjoicG9zdF9saW5rX3VybF9wb3N0Iiwic2V0dGluZ3MiOnsicG9zdF9pZCI6IjIzMjIyMjI5In19@“ global_colors_info=“{}“ sticky_transition=“on“]<\/p>\n

AP&S gewinnt zum dritten Mal in Folge den productronica Innovation Award im Cluster Semiconductor \u2013 und wir k\u00f6nnten nicht stolzer sein! <\/span><\/p>\n

Zuletzt konnte unser <\/span>CleanSurF automated<\/strong>, der vollautomatisierte Boxenreiniger, die Jury \u00fcberzeugen.<\/span><\/p>\n

[\/et_pb_slide][et_pb_slide heading=“#AP&S WebWorker“ button_text=“Mehr Informationen“ button_link=“https:\/\/www.ap-s.de\/service\/#WebWorker“ use_bg_overlay=“on“ _builder_version=“4.27.4″ _module_preset=“default“ background_enable_color=“off“ background_image=“https:\/\/www.ap-s.de\/wp-content\/uploads\/2025\/12\/aps_webworker_blau.jpg“ background_enable_image=“on“ link_option_url=“https:\/\/www.ap-s.de\/service\/#WebWorker“ global_colors_info=“{}“ sticky_transition=“on“]<\/p>\n

Alle Anlageninformationen werden sicher im AP&S IoT-Portal gespeichert und sind f\u00fcr autorisierte Benutzer weltweit zug\u00e4nglich \u2013 sowohl auf Desktop-Computern als auch auf Mobilger\u00e4ten.<\/p>\n

Dies spart wertvolle Zeit, vereinfacht die Fehlerbehebung und erh\u00f6ht die Effizienz bei Wartungsarbeiten direkt vor Ort.<\/p>\n

[\/et_pb_slide][\/et_pb_fullwidth_slider][\/et_pb_section][et_pb_section fb_built=“1″ _builder_version=“4.18.0″ _module_preset=“default“ background_enable_color=“off“ background_enable_image=“off“ parallax=“on“ parallax_method=“off“ custom_padding=“||22px|||“ global_colors_info=“{}“][et_pb_row column_structure=“2_3,1_3″ make_equal=“on“ _builder_version=“4.20.2″ _module_preset=“default“ custom_padding=“||25px|||“ global_colors_info=“{}“][et_pb_column type=“2_3″ _builder_version=“4.20.2″ _module_preset=“default“ global_colors_info=“{}“][et_pb_text _builder_version=“4.16″ _module_preset=“default“ text_font=“|700||on|||||“ text_text_color=“rgba(0,0,0,0.3)“ text_font_size=“13px“ text_letter_spacing=“2px“ header_2_font_size=“73px“ custom_margin=“||9px|||“ global_colors_info=“{}“]<\/p>\n

BeREICHE<\/p>\n

[\/et_pb_text][et_pb_text _builder_version=“4.21.0″ _module_preset=“default“ text_font=“||||||||“ header_2_font_size=“54px“ custom_margin=“||0px||false|false“ header_2_font_size_tablet=“60px“ header_2_font_size_phone=“44px“ header_2_font_size_last_edited=“on|phone“ global_colors_info=“{}“]<\/p>\n

Hightech & Expertise<\/h2>\n

Seit \u00fcber 20 Jahren liefern wir leistungsstarke Nassprozessanlagen f\u00fcr die Oberfl\u00e4chenbehandlung von Wafern an die f\u00fchrenden Halbleiterhersteller weltweit. Unser modulares Produktspektrum ist perfekt auf die Bed\u00fcrfnisse der Halbleiterbranche zugeschnitten, unabh\u00e4ngig davon, ob eine Standard-Nassprozessanlage oder eine kundenspezifische L\u00f6sung ben\u00f6tigt wird.<\/p>\n

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Produkte<\/h3>\n

Chemische Nassprozesse sind unsere Leidenschaft. Als f\u00fchrender Anbieter f\u00fcr die Halbleiterindustrie, MEMS- und Mikroelektronikindustrie bieten wir Nassprozessanlagen f\u00fcr Batch-Prozesse und Single Wafer- Prozesse sowie prozessunterst\u00fctzendes Equipment!<\/a><\/p>\n

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Anwendungsfelder<\/h3>\n

Wir bieten eine umfassende Palette an chemischen Nassprozessen f\u00fcr die Wafer-Bearbeitung im Mikrochip-Herstellungsprozess: Reinigung, Trocknung, \u00c4tzung, Resist-Stripping, Entwicklung, Lift-off, stromlose Metallabscheidung f\u00fcr UBM und weitere.<\/p>\n

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Service<\/h3>\n

Mit einem ganzheitlichen After-Sales Konzept stellen wir die nachhaltige Kundenunterst\u00fctzung weltweit sicher. Zuverl\u00e4ssig und kompetent: Ob es um Serviceeins\u00e4tze, Ersatzteilbeschaffung, Modernisierung (Refurbishment) oder Nassprozess-Schulungen geht.<\/p>\n

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Unternehmen<\/h3>\n

Weitsichtig, kundenorientiert, innovativ und dem stetigen Fortschritt verpflichtet \u2013 das ist AP&S und seine Nassprozessanlagen. In der Halbleiterindustrie weltweit zu Hause, gestalten wir die Zukunft der Halbleiterproduktion mit!<\/p>\n

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In unserem Nassprozesslabor „DemoLAB“ bieten wir Prozessentwicklung und
-modifikation f\u00fcr Standard- sowie innovative Halbleitermaterialien wie SiC, GaN-on-Si\/SiC, InP sowie Nassprozess-Demonstrationen.<\/p>\n

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NASSPROZESSE<\/p>\n

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Kernkompetenz im \u00dcberblick<\/h2>\n

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Unsere modularen Nassprozessanlagen, welche Techniken wie das Eintauchen, Schleudern oder Spritzen anwenden, decken die spezifischen Anforderungen der Halbleiterindustrie bestens ab.<\/p>\n

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Reinigungsprozesse unter Verwendung von Reinchemikalien erfordern ad\u00e4quate reine Ger\u00e4tel\u00f6sungen mit fortschrittlicher Oberfl\u00e4chen- und Strukturwechselwirkung.<\/p>\n

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\u00c4tzprozesse der verschiedenen SC-Materialien erfordern eine Hardware, die f\u00fcr die verwendeten hochreinen \u00c4tzchemikalien optimiert ist.<\/p>\n

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Nach dem \u00c4tzen ist die Struktur ein permanenter Teil der oberen Wafer-Schicht. Der Lack, der als \u00c4tzbarriere fungiert hat, wird von der Oberfl\u00e4che entfernt.<\/p>\n

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Die Lackstruktur wird durch die chemische Aufl\u00f6sung des nichtpolymerisierten Lackbereichs entwickelt. Die Entwicklung bildet in der Lackschicht eine Struktur mit den genauen Abmessungen, die im Prozess von Schaltungsentwicklungen festgelegt wurden.<\/span><\/p>\n

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Metallstruktur-\u00c4tztechnologien f\u00fcr Al, Ti, W und andere: Vollst\u00e4ndige Entfernung von Metallen von Ger\u00e4te- oder Monitor-Wafern f\u00fcr Wafer bis zu einem Durchmesser von 300 mm.<\/p>\n

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Das Flip-Chip-Bonding ist von zunehmender Bedeutung f\u00fcr die weitere Miniaturisierung von Bauelementen. Die Under-Bump-Metallisierung wird mit stromloser Abscheidungstechnologie auf Al-Legierungs- und Cu-Substraten durchgef\u00fchrt.<\/p>\n

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Marangoni-Trocknung: Die Oberfl\u00e4chenspannung des Wassers besitzt eine einzigartige Beschaffenheit, wenn Wafer langsam durch eine Wasseroberfl\u00e4che gezogen werden: Die Spannung zieht das Wasser von der Oberfl\u00e4che weg und l\u00e4sst die Wafer trocken.<\/p>\n

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Metal-Lift-Off ist ein Strukturierungsprozess, der die \u00c4tzvariationskomponente eliminiert. Die Wafer werden in einem Entwicklungsschritt verarbeitet, wobei ein Loch in der Lackschicht verbleibt, in dem sich die abgeschiedene Schicht \u00fcber dem Lack und in der \u00d6ffnung befindet.<\/span><\/p>\n

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Team<\/p>\n

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Teamplayer<\/h2>\n

Der Zusammenhalt unserer Belegschaft ist die treibende Kraft f\u00fcr unseren Erfolg. Es ist die Individualit\u00e4t unserer Kolleg:innen, die wie Puzzleteile ineinandergreifen und die modernen und dynamischen Arbeitsstrukturen unseres Unternehmens entstehen lassen.<\/span><\/p>\n

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Innovative Nassprozessl\u00f6sungen LIVE erleben! Entdecken Sie auf der SEMICON Europa unsere neuesten L\u00f6sungen f\u00fcr Cleaning, Etching, Plating und Digitalisierung. 10.\u201313. November 2026 | Stand B 1656    AP&S w\u00e4chst weiter: Neuer Standort in Dresden schafft Raum f\u00fcr Academy, Konsignationslager und Kundenn\u00e4he. Der neue Firmensitz befindet sich am Manfred-von-Ardenne-Ring 13 und liegt nur rund 250 Meter […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"_et_pb_use_builder":"on","_et_pb_old_content":"","_et_gb_content_width":"","footnotes":""},"class_list":["post-155","page","type-page","status-publish","hentry"],"acf":[],"publishpress_future_workflow_manual_trigger":{"enabledWorkflows":[]},"_links":{"self":[{"href":"https:\/\/www.ap-s.de\/zh\/wp-json\/wp\/v2\/pages\/155","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.ap-s.de\/zh\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.ap-s.de\/zh\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.ap-s.de\/zh\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.ap-s.de\/zh\/wp-json\/wp\/v2\/comments?post=155"}],"version-history":[{"count":40,"href":"https:\/\/www.ap-s.de\/zh\/wp-json\/wp\/v2\/pages\/155\/revisions"}],"predecessor-version":[{"id":23222839,"href":"https:\/\/www.ap-s.de\/zh\/wp-json\/wp\/v2\/pages\/155\/revisions\/23222839"}],"wp:attachment":[{"href":"https:\/\/www.ap-s.de\/zh\/wp-json\/wp\/v2\/media?parent=155"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}