Batch Processing

vertical wafer handling

WET BENCHES

High throughput, optimized process running costs, easy and comprehensive process control, consistent deposition results and processing of multiple wafers on both sides at once are the main characteristics of AP&S batch processing tools for the semiconductor devices and microelectromechanical systems (MEMS) manufacturing.

The AP&S batch processing portfolio includes basic manual wet benches for laboratories or R&D purposes as well as fully-automatic high-end technology benches for high volume production. Due to the perfectly tuned interaction between our product design, automation and required chemicals our wet process solutions for batch processing offer process reliability, optimized process times, cost-efficiency and highest flexibility for the customer.

The AP&S wet benches perform cleaning, drying, etching, metal etching, electroless plating, PR strip and metal lift-off processes for wafers up to 12” and masks.

PRODUCTS

BATCH PROCESSING

Manual
Wet Bench

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Standalone
Dryer

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TwinStep

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MultiStep

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GigaStep

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TeraStep

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A-Series 

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Vulcanio

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BATCH PROCESSING

Manual Wet Bench

Manual wet bench with a high level of process capabilities on a small footprint.
Main Benefits
  • Maximum flexibility and fast installation through a modular design
  • Optimized footprint
  • Wide spectrum of customization and expansion options:
    available as classic manual wet processor and as fume hood for higher safety standards;
    different material designs available:
    cost-effective PP as well as FM 4910 compatible material
Wafer sizes up to 12”
Substrates

Wafers, MEMS, optoelectronics, photomasks, glass substrates

Material configuration:

Si, SiC, GaN, GaAs, Sapphire, Glass, Quartz

Processes
  • SC1
  • SC2
  • HF (in all concentrations)
  • DSP
  • KOH
  • SPM, TMAH, H3PO4
  • Solvent processes in a stainless steel version
  • Other on request
Important technical features
  • Recirculation capability
  • Ultrasonic: 40/80/120 KHz, 250/500 KHz
  • Megasonic: 1000 KHz, other frequencies possible
  • Rinse tank: final rinse, quick dump, overflow option
  • Option examples: DI/N2 spray gun, FM4910, N2 bubling, premix tanks

Batch Processing

NID Dryer

Efficient drying tool for wafers up to 300mm, thin wafers, ICs, MEMS, LED, photomasks and glass substrates.
Main Benefits
  • One drying tool for different substrates 
    wafer thickness from 120 to 2000µm 
    without modification
  • Available as a stand-alone unit or integrated in a wet bench
  • Average process time 10 - 15 minutes*
  • Tool demonstration in the AP&S Demo Center is available
Wafer sizes up to 12”
Substrates

Wafers, MEMS, optoelectronics, photomasks, glass substrates

Material configuration:

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes

Drying processes with IPA and Hot-N2

Important technical features
  • For high or low profile cassettes
  • Low IPA consumption: ≤ 30 ml / run
  • Ideally suited for thin wafers
  • Complies with: CE, SemiS2 and S8, FM 4910, SECS/GEM
  • Proven reliability:
    MTBF ≥ 800 h
    Uptime ≥ 97 %
NID loading capacity
  • NID Dryer slim
    100–200mm: single cassette or double cassettes
    300mm: single cassette
  • NID Dryer big (high throughput)
    100–200mm: up to 4 cassettes (100 wafer)
    300mm: up to 2 cassettes

*depends on customer’s product and technology

Batch Processing

TwinStep

Semi-automated wet bench with two process tanks for wafers up to 300mm.
Main Benefits
  • Smart, modular construction – access needed from two sides only (front and back)
  • Comfortable handling and loading from front side above the rinse tank
  • Superior reliability and process reproducibility with 97 % uptime
  • Robust wafer handling system for highest process safety
Wafer sizes up to 12”
Substrates

Wafers, MEMS, optoelectronics, photomasks, glass substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes
  • Various etching and cleaning processes
  • TwinStep tools in combination with NID Dryers (integrated or as stand-alone) enable a high process performance
Important technical features
  • Optimized footprint (LxWxH): approx. 900 x 1625 x 2000 mm
  • Processes 2 x 25-wafer batches of 100–200mm or 1 x 25-wafer batch of 300mm substrates
  • Complies with FM 4910, SEMI S2 and S8, SECS/GEM, CE   
  • Process control via latest software technology: 
    sensor - software interface, suitable to in-house tracking system, extensive process documentation (consumption, media, temperature, cleaning cycles, end of run, log in), individual recipes
  • Mechanical agitation via robot recipe adjustable 

BATCH PROCESSING

MultiStep

Semi-automated wet bench for wafers up to 200mm with a small footprint and a wide range of configuration options.
Main Benefits
  • Smart, modular construction for comfortable and cost-efficient installation and maintenance as well as for high flexibility regarding upgrades
  • Multi wafer-sizes (100–200mm) and -thickness (110µm–2000µm) processing without tool modification
  • Superior reliability with an uptime of ≥ 97 %
Wafer sizes up to 8”
Substrates

Wafers, MEMS, optoelectronics, photomasks, glass substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes
  • Different wet cleaning processes
  • RCA
  • Pre-Diffusion clean
  • Various etching processes, including oxide, nitride, poly crystalline, metals and silicides
Important technical features
  • Optimized footprint
  • Tool configuration is cost-efficiently adjustable according to future product / process changes and customer needs
  • Processes 2 x 25-wafer batches of 100–150mm 
    or 1 x 25-wafer batch of 200mm substrates
  • Complies with: FM 4910, SEMI S2 and S8, SECS, GEM, CE
  • Process control via latest software technology:
    sensor - software interface, suitable to in-house tracking system, extensive process documentation (consumption, media, temperature, cleaning cycles, end of run, log in), individual recipes
  • Singular mechanical agitation feature in each module

Batch Processing

GigaStep™

Semi-automated modular, compact wet bench for wafers up to 300mm including all necessary process steps.
Main Benefits   
  • Smart, modular construction for comfortable and cost-efficient installation and maintenance as well as for high flexibility regarding upgrades and possible integration of additional modules in case further process configuration steps are needed
  • Multi wafer-size and -thickness processing without tool modification
  • Superior reliability with an uptime of ≥ 97 %
Wafer sizes up to 12”
Substrates

Wafers, MEMS, optoelectronics, photomasks, glass substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes
  • Different wet cleaning processes
  • RCA
  • Solvent applications
  • Solvent applications combined in one tool with chemical applications
  • Pre-Diffusion clean
  • Various etching processes, including oxide, nitride, poly crystalline, metals and silicides
Important technical features
  • Optimized footprint
  • Tool configuration is cost-efficiently adjustable according to future product / process changes and customer needs
  • Processes 2 x 25-wafer batches of 150–200mm substrates, 1 x 25-wafer batch of 300mm wafers
  • Complies with: FM 4910, SEMI S2 and S8, SECS, GEM, CE
  • Dry-in -> Dry-out or Dry-In -> Wet-out possible  
  • Process control via latest software technology:
    sensor - software interface, suitable to in-house tracking system, extensive process documentation (consumption, media, temperature, cleaning cycles, end of run, log in), individual recipes
  • Singular mechanical agitation feature in each module 

Batch Processing

TeraStep™

Innovative, fully automated platform, including multi wafer-sizes and -thickness processing.
Main Benefits
  • Multi wafer-thickness processing from 40 to 200µm, 
    TAIKO up to 2000 µm, double stacked wafers
  • Chemistry and solvent processes combined in one tool possible
  • Different cassette profiles (high or low)
Wafer sizes up to 12”
Substrates

Wafers

Wafer material

Si, GaN

Processes
  • Different wet cleaning processes
  • RCA
  • Solvent applications
  • Solvent applications combined in one tool with chemical applications
  • Pre-Diffusion clean
  • Various etching processes, including oxide, nitride, poly crystalline, metals and silicides
Important technical features
  • FOUP system suitable (300mm)
  • SMIF system suitable (200mm)
  • Processes 25/50 wafer batches
  • Automatic loading station incl. thin wafer handling
  • Dry-in -> Dry-out processing
  • Cassette buffer
  • Automatic loading by robot system or OHT possible
  • Complies with: FM 4910, SEMI S2 and S8, SECS, GEM, CE
  • Process control via latest software technology:
    sensor - software interface, suitable to in-house tracking system, extensive process documentation (consumption, media, temperature, cleaning cycles, end of run, log in), individual recipes

Batch Processing

A-Series

Fully automated high throughput platform for wafers up to 200mm.
Main Benefits
  • 100 wafer half-space processing for optimized bath and footprint utilization
  • High throughput by optimized process times >10.000 wafers per day*
  • Comprehensive process and bath stability control and regulation for lower production costs, higher process reliability, less chemical consumption and fast release process after bath change
Wafer size 6” or 8”
Substrates

Wafers

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Processes
  • Different wet cleaning processes
  • RCA
  • Pre-Diffusion clean
  • Various etching processes, including oxide, nitride, poly crystalline, metals and silicides
Important technical features
  • SMIF system suitable (150, 200mm)
  • Automatic loading by robot system or OHT possible
  • Designed for up to 100 wafer batches
  • Dry-in -> Dry-out processing
  • Complies with: FM 4910, SEMI S2 and S8, SECS, GEM, CE
  • Process control via latest software technology:
    sensor - software interface, suitable to in-house tracking system, extensive process documentation (consumption, media, temperature, cleaning cycles, end of run, log in), individual recipes
  • Proven reliability: uptime ≥ 97 %

*depends on process

Batch Processing

Vulcanio

Fully automated electroless plating tool for wafers up to 300mm.
Main Benefits
  • Specially designed and optimized for UBM (Under Bumping Metallization) of Aluminium or Copper pads (Nickel, Palladium, Immersion Gold)
  • Unique software and hardware features ensure exceptional deposition uniformity, bath longevity and unbeatable cost of ownership ratio
  • Process-tailored analyzers and optimized dosage provide comprehensive process control and highest reliability 
  • Advanced eless and pretreatment bathes control
Wafer size 6”, 8" and 12”
Substrates

Wafers

Wafer material

Si, SiC, GaN

Processes
  • Electroless UBM for AL and Cu pads (Ni, Pd, Au)
  • Different wafer thicknesses incl. extra-thin wafers can be processed without any tool modification
  • OPA: 15–170 % open plating area possible
Important technical features
  • FOUP system suitable (300mm)
  • SMIF system suitable (150, 200mm)
  • Processes 25 or 50 wafer batches of 150–300mm wafers
  • Operates with high- and low-profile cassettes
  • Dry-in -> Dry-out processing
  • Complies with: FM 4910, SEMI S2 and S8, SECS, GEM, CE
  • Process control via latest software technology:
    sensor - software interface, suitable to in-house tracking system, extensive process documentation (consumption, media, temperature, cleaning cycles, end of run, log in), individual recipes
Eless-Plating

Since many years AP&S eless equipment is used for under bump metallization in batch processes for mass-volume production. Due to increasing requirements on process performance various optimizations were done to meet future requirements on chip designs. By modification of key features for hydrodynamic behaviour of electrolyte solution within the process tank, deposition uniformity has been significantly improved. In the following bitmaps on page 17 deposited metal uniformity with state-of-the-art hardware (2013, left) vs. modified hardware (2018, right) is shown. The diagram shows the progress in optimization of deposited metal uniformity on 200mm wafers. Process performance is generally strongly dependent on wafer surface and eless electrolyte solution.

“Semiconductor manufacturing is constantly changing, which is a reason that AP&S invests heavily in the development of our portfolio. With AP&S the semiconductor and MEMS producers have a reliable supplier offering them everything they need for effective surface treatment of wafers and other substrates.”

Tobias Bausch, Director Sales & Marketing

Contact

Sales Team

+49 771 8983-0