AP&S

Company

We are your partner for wet process equipment

 

AP&S International GmbH is one of the leading providers of batch- and single wafer wet process solutions for surface treatment of substrates under cleanroom conditions for customers worldwide. Our product portfolio includes manual, semi-automated and fully automated wet process tools perfectly fitting to the requirements of the semiconductor-, MEMS- and micro-structuring industries as well as the R&D sector. Additional to our cleaning, etching, stripping, plating and lift-off solutions for flat/wafer-based substrates (silicon, gallium arsenide, germanium, sapphire etc.) we deliver peripheral equipment for parts cleaning, chemical media distribution and management. Furthermore, we offer refurbishment programs for used wet process tools like FSI Mercury, Steag and other. Our headquarters is located in Donaueschingen, Germany. The company’s subsidiaries are in China, Singapore and Malaysia. AP&S International GmbH employs 160 people around the world.

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Newsroom

News

Unusually colorful, loud and with more than 60 children in a crowd of 200 people -  that´s how it was in the industrial district Donaueschingen-Aasen,...

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Highlights

On 4th April, with as many participants as never before, the important industry event for international silicon technology will start in the...

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SOLUTIONS

Solutions

FULL RANGE OF WET PROCESS SOLUTIONS

Whether a standard tool or a customer-specific solution is required: 
Our modular product spectrum is tailored to your needs!

The AP&S product range includes manual, semi-automated and fully automated wet process tools for the semiconductor-, MEMS- and micro-structuring industries as well as the R&D sector. Our wet process equipment is ready for cleaning, etching, metal etching, PR strip, electroless plating, lift-off, drying and developing processes.

BATCH PROCESSING

High throughput, optimized process running costs, easy and comprehensive process control, consistent deposition results and processing of multiple wafers on both sides at once are the main characteristics of AP&S batch processing tools for the semiconductor devices and microelectromechanical systems (MEMS) manufacturing.

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SINGLE WAFER
PROCESSING

The AP&S single wafer solutions are the right choice for you, when high precision processes with high uniformity, high level of repeatability and significantly precise process control are required.

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SUPPORTING
EQUIPMENT

To ensure efficient wet processes in our customers’ semiconductor fabs is our primary goal. Therefore, supporting equipment like foup and box cleaner, drying tools for wafers, laboratory equipment and chemical management solutions belong to our product range too.

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SERVICES &
SPARE PARTS

The AP&S After Sales Unit provides fast and competent support for customers worldwide, ensuring process reliability and high uptime.

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Applications

Applications

WET PROCESS APPLICATIONS OVERVIEW

AP&S offers innovative solutions for cleaning, etching, plating, lift-off, developing,
drying and other wet processes. 

With a wide range of modular wet equipment using different techniques like wet immersion, spin or 
spray process, AP&S covers the specific needs of the semiconductor-, MEMS- and micro-structuring 
industries as well as the R&D sector.  

At the AP&S Demo Center, an in-house laboratory located at the German headquarters,
we can run spin process demonstrations with wafers, masks or other substrates.

Cleaning

Cleaning processes using ultra high purity chemistries require adequate pure equipment solutions with advanced surface and structural interaction. The hardware design focus is on the cleaning efficiency in variable structures at different aspect ratios.

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Etching

Etch processes for the different SC- materials require hardware optimized to the used high purity etch-chemistries. Low sigma variations of the etched structural dimensions from across chip, across wafer and wafer to wafer are the main target for wafer sizes up to 300mm. The effective removal of the etched materials in the structure is achieved by the optimized hydro-dynamic flow conditions in the equipment and the AP&S dryer concepts contribute to low particulate levels.

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PR Strip

After etching, the pattern is a permanent part of the top layer of the wafer. The resist that has acted as an etch barrier is removed from the surface.

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Developing

The pattern of the resist is developed by the chemical dissolution of the unpolymerized resist region. Development will form in the resist layer a pattern with the exact dimensions designated during the circuit design process.

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Metal Etching

Metal pattern etch technologies for Al, Ti, W and others. Complete removal of metals processes from device- or monitor- wafers for wafers up to 300mm diameter, using hardware tailored to the specific chemistries needed for each metal composite.

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E-Less Plating

Flip chip bonding is of increasing importance to further device miniaturization. Under-bump metallization is deposited in electro-less deposition technology on Al-alloy and Cu- substrates.

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Lift-off

Metal-Lift-Off is a pattering process that eliminates the etch variation component. Wafers are processed through the development step, leaving a hole in the resist layer where a deposited layer is to be located on top of the resist and into the opening.

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Drying

Water surface tension creates a unique condition when wafers are pulled slowly through a water surface. The tension draws the water away from the surface, leaving it dry.

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BENEFITS

Customer Benefits

CUSTOMER IN FOCUS

Making a decision for AP&S means, getting a competent, reliable, long-term partner. We offer you much more than just the required semiconductor equipment:

TRUST

Trust in our competence. As an owner-managed company with a focus on the semiconductor industry and a company history starting in 1995 we offer you extensive experience and reliability. 

EFFICIENCY

Our long-lasting experience in creating customer-oriented automation technology, extensive expertise in chemical wet processing and continuous dialogue with our customers – these three decisive aspects form the basis for the efficiency of our products.

 

INNOVATION

Following our goal of continuous development, we invest more than 10% of our annual turnover in research and development. Thereby, the customer benefit is always our pulse. With innovative wet process solutions we want to support the development of new technologies and in this way contribute to our customers’ success.

PROCESS

Highly trained team of process engineers, continuous development of chemical processes in our in-house laboratory “Demo Center” and several partnerships with renowned institutes and chemical suppliers ensure the high quality and efficiency of our wet processes.

 

R&D

Innovation leader

To live innovation -
is what drives us at AP&S

Based on the requirements of the semiconductor industry, we follow the principle of continuous development and improvement. Therefore, we invest more than 10% of our annual turnover in research and development. The customer benefit is always our pulse. Which means, by supplying innovative wet process technologies we strive to meet optimally current and future market needs and to contribute to our customers’ success.

Innovation

For outstanding innovation achievements AP&S received two important awards in 2018, which are: Top 100 Award and Infineon’s Supplier Award Best Innovation 2018.

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Demo Center

Wet process equipment demonstrations, test reports, complete parameters of the process set-up, recommendations for the process recipe, analyzes and further system configuration details, is what you receive in our in-house laboratory, the Demo Center.  

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IoT & Smart Manufacturing

With the software company tepcon, our affiliated company, we have a strong partner, who develops effective and unique solutions in the field of digitization: intelligent machine functions and process controls in our wet process equipment are the results.

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Career

Career

WORKING AT AP&S

We are a team-oriented company, that promotes the independence and creativity of its employees, is breaking new ground, advancing the development of our staff and is looking beyond regional borders thanks to our international orientation. Our working style is characterized by open communication, transparent processes and quick decision-making achieved by a flat hierarchical structure and short communication channels. The community of our employees is the driving force behind our success. It is the individuality and dedication of each individual, that intermesh seamlessly like pieces of a puzzle and create the modern and dynamic working structures of our company.