Diversity and multifunctionality await visitors at the AP&S booth 621/hall A4 at Semicon Europa 2018


From 13 to 16 November 2018 Semicon Europa, the leading trade fair for the European semiconductor market, will take place in Munich as part of electronica. AP&S will be exhibiting this year again. In addition to a variety of technological highlights, the company as a whole will be in focus this time.

 "We want to offer our visitors a trade fair experience, that gives them an extensive insight into AP&S. Our products and services are versatile, the current company developments as well. We are currently investing 3.5 million euros in the construction of a new clean room and an additional production hall at the headquarters in Donaueschingen. This investment brings significant benefits to our customers, which of course will be a topic. Furthermore, the presence in Munich gives us the opportunity to celebrate our this year's award as Top 100 Innovator together with our customers," explains Tobias Bausch, Director Sales & Marketing at AP&S.

For the first time the new AP&S wet process tool TeraStep® will be presented. The MULTI-TOOL convinces with its multifunctionality, as it processes 12'' and 8'' wafers, double stacked and extra thin wafers, chemistry and solvents as well as different contamination types.

Endpoint detection is the company's new key feature for single wafer etch processing. The Spin-Step® tools equipped with this system, offer improved process stability, reproducibility, optimum process time and enable process media to be used in reclaim.

Predictive maintenance and fab-planning 4.0 are brought to the market by the versatile AP&S Augmented Reality solution. With customer benefit in focus, it offers: optimized fab planning; solution-oriented construction process; time and cost savings and scheduled spare parts exchange. This innovation will also be presented at the Fab Management Forum on Tuesday 13th November at 15:10.

Another AP&S presentation with the title "UBM Metallization Technology for advanced semiconductor devices" will be taking place in the TechLonge on Thursday 15th November at 11:45. Here the audience will get to know the basic aspects, benefits and crucial parameters of a successful e-less process.

Requests for a meeting at SEMICON Europa can be sent to 

To read this news in German, please click here.