Efficient wet process solutions for your semiconductor production. Whether you need a standard system or a customized wet process solution: Our modular product range is perfectly tailored to your needs!
Single Wafer Processes
High-precision processes with high uniformity, high repeatability and extremely precise process control for horizontal wafer processing
AP&S' single wafer processing portfolio includes a variety of processes for the semiconductor and MEMS production chain: cleaning, drying, etching, metal etching, photoresist (PR) stripping and metal lift-off processes.
The in-house AP&S laboratory "DemoCenter" offers you a wide range of demonstrations with the single wafer tool.
Our horizontal wafer handling machines can handle all standard substrate formats: 100 mm, 125 mm, 150 mm, 200 mm and 300 mm. Thereby, we cover all common substrate materials and substrate thicknesses in semiconductor production.