Eless Plating, wet process developments for SIC and further innovations - This is what you can expect at the AP&S booth at Semicon Europa


It has been a long time and our anticipation for Semicon Europa in Munich is all the greater. From November 16 to 19, 2021, the leading European trade fair for the semiconductor industry will take place as a presence event and we will be there!

"After such a long break due to Corona, finally going to a trade fair again, meeting customers and partners in person, experiencing impulse-rich conferences and entering into dialog with industry experts is something we are very much looking forward to," says Tobias Drixler, COO at AP&S. "Especially in the semiconductor industry, where dynamics and constant progress are the measure of all things, exchange is essential. Contributing to constant progress is also our maxim. This year, we will bring innovations to Semicon Europa that will optimally support our customers in their challenges in the fabs," says Tobias Bausch, AP&S CMO & CTO.



Vulcanio is our answer to the increasing importance of flip-chip bonding and the steady miniaturization of devices. This wet bench is a fully automated, high throughput eless UBM metallization system for wafers up to 300mm and offers very good TCoO performance. The batch tool is specifically designed for under-bump plating with electroless deposition technology on Al- and Cu-based substrates for metallization with nickel, palladium and gold. Vulcanio processes various wafer thicknesses including thin wafers and TAIKO. This equipment convinces with exceptional deposition uniformity, highest process stability as well as long bath durability: e.g. Ni bath with a bath durability of 1-1.5 weeks. Furthermore, a reduction of the Au metal thickness from > 0.5 µm to 0.05 µm is possible without any loss of performance.


CleanSurF® is the new AP&S cleaner for FOUPs, SMIFs, carriers and boxes. The system ensures maximum cleanliness of all common wafer boxes according to the highest cleanliness standards and thus contributes to securing the process chains in semiconductor manufacturing. The concept is optimized for both manual and automatic loading. A connection to a FOUP stacker for cleaning during intermediate storage of the containers is also possible. An innovative nozzle concept and a new carousel design contribute decisively to efficient particle and AMC removal as well as to shorter process times. The unit has a compact footprint of approximately 3 m² and a high loading capacity of up to 12 x 12 inch FOUPs per run. A second process chamber door provides a convenient airlock function for gray room-clean room separation.

Process development for innovative materials SiC and GaN

Innovative materials such as SiC and GaN are becoming increasingly important in chip production, especially with regard to electric cars. AP&S is responding to this trend and offers wet process development for innovative materials in the DemoCenter at the company's headquarters. This allows customers to completely outsource development projects for new or critical materials and chemicals. AP&S's comprehensive development support takes all the preliminary work for introducing a new process off the customer's hands. Based on the results of the Demo Center, the customer builds on the process that has been proven to be the most efficient.

Would you like to learn more? Then we look forward to your visit at our booth at Silicon Saxony area B1221. For an appointment request, please contact our sales department: