NID Dryer
Efficient drying plant for IPA drying in combination with N2
NID Dryer
AP&S PRODUCTS
The All-Rounder
The NID dryer provides fast, uniform and energy-efficient drying of wafers in semiconductor production.
Main Benefits
- One dryer for different substrates up to 300 mm: 25 or 50 wafer batches
- Wafer thickness from 120 to 2000 µm without modification
- Available as a stand-alone unit or integrated into a wet process bench
- Average process time 10-12 minutes
Processes
Drying processes with IPA and N2
Substrates
- Substrates
Wafers, MEMS, optoelectronics, photomasks, glass - Wafer material
Si, SiC, GaN, GaAs, sapphire, glass - Wafer sizes
up to 12″
Technical Features
- For cassettes with high or low profile
- Low IPA consumption: ≤ 30 ml / run
- Ideally suited for thin wafers
- Complies with: CE, SemiS2 and S8, FM 4910, SECS / GEM
- Proven Reliability:
MTBF ≥ 800 h
Operating time ≥ 97 %
