SpinScrubber

Wet-chemical single wafer process system for efficient particle removal on the surfaces of wafers, MEMS and photomasks

SpinScrubber

AP&S PRODUCTS

Efficient Particle Removal

The SpinScrubber single wafer system provides post grind, post polish, bevel clean and other chemical wet processes for substrate surfaces in semiconductor manufacturing.

Main Benefits

  • Optimized CoC through low chemical and water consumption: chemical recovery and recycling included
  • Parallel cleaning of the front and back side of the wafer is possible.
  • Handling of thin wafers
  • Up to two different cleaning media in one process tray - A tool demonstration in the AP&S DemoCenter is available.

Processes

  • Post grind
  • Post polish
  • Post CMP
  • Backside
  • Reclaim
  • Bevel clean
  • TSV cleaning

Substrates

  • Substrates
    Wafers, MEMS, optoelectronics, photomasks, up to 9" and square substrates
  • Wafer material
    Si, SiC, GaN, GaAs, sapphire, glass
  • Wafer sizes
    up to 12″

Technical Features

  • Easy configuration and flexible upgrading due to modular design
  • Maximum safety for workers, plant and environment according to highest safety standards
  • Optimized plant footprint, easy feed
  • No expensive space for the Chemicals Management System in the clean room is required as it can be placed outside.
  • Customized cleaning media on request

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AP&S Products in Use

If you have any questions or would like to contact us, we look forward to meeting you.