GigaStep

Semi-automatic, modular and compact wet bench with all necessary process steps for wafers up to 300 mm

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GigaStep

AP&S PRODUCTS

Comprehensive

This system convinces by its smart and modular design. Various wet cleaning processes for different wafer sizes and thicknesses can be used on a compact footprint.

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Main Benefits

  • Smart, modular design for convenient and cost-effective installation and maintenance as well as for high flexibility for upgrades
  • Different wafer sizes and thicknesses can be processed, no adjustments/modifications to the system are required for this purpose.
  • Highest reliability with a plant operating time of ≥ 97%

Processes

  • Different wet cleaning proceses
  • RCA
  • Solvent applications
  • Solvent applications combined with chemical applications
  • Pre-diffusion
  • Pre-metal
  • Different etching processes, including oxide, nitride, polycrystalline, metals and silicides

Substrates

  • Substrates
    Wafers, MEMS, optoelectronics, photomasks, glass
  • Wafer material
    Si, SiC, GaN, GaAs, sapphire, glass
  • Wafer sizes
    up to 8″

Technical Features

  • Optimized plant footprint
  • The plant configuration can be adapted cost-effectively to future product/process changes and customer requirements.
  • Processes 2 x 25-wafer batches of 6" to 8" substrates
  • Complies with: FM 4910, SEMI S2 and S8, SECS, GEM, CE
  • Dry-in/Dry-out or Dry-in/Wet-out possible
  • Process control through the latest software technology:
    Sensor software interface, suitable for in-house tracking system, extensive process documentation (consumption, media, temperature, cleaning cycles, end of run, login), individual recipes

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If you have any questions or would like to contact us, we look forward to meeting you.

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