NexAStep
Our fully automated batch tool for high throughput wet processing.
AP&S PRODUCTS
Maximum yield & throughput
High throughput, compact design, uninterrupted production flow, fast processes, reduction of particle generation & contamination
The main feature of batch processes for the production of semiconductor devices and
microelectromechanical systems (MEMS) is the simultaneous processing of multiple wafers on the front and back side. Due to the perfectly coordinated interaction of product design, automation and the required chemicals, our wet process solutions for batch processing offer maximum process reliability, optimized process times, cost efficiency and maximum flexibility.
In response to the growing demand for faster and more efficient wet process tools, NexAStep was designed to streamline and accelerate the wafer processing workflows. By integrating cutting-edge technology and automation, NexAStep promises to significantly enhance the productivity and reliability of processes, marking an substantial leap forward in the field of semiconductor industry.
The fully automated high-throughput NexAStep platform offers more functions in a more compact space for maximum yield. This system has a modular design and has all the advantages of the Modularity.
Main Benefits
- Wafer-friendly transport and maximum speed during empty runs thanks to a highly dynamic axis system
- Optimal use of the clean room due to compact design of the system and efficient arrangement of chemical supply, drains, receiver tanks and control cabinets in the module footprint
- Modular concept enables fast assembly, disassembly and conversion
- Uninterrupted production flow due to an integrated storage unit with up to 75 storage spaces
Processes
- Different wet cleaning processes
- RCA
- Pre-diffusion
- Pre-metal
- Different etching processes, including oxide, nitride, polycrystalline, metals and silicides
Substrates
- Substrates
Wafers - Wafer material
Si, SiC, GaN - Wafer sizes
8″
Technical Features
- Up to 12 LMC carriers of 100 wafers (8/6 inch) with half spacing or 50 wafers (8/6 inch) with normal spacing for efficient processing
- Reduced process times possible due to increased process temperature of up to 170° C
- Reduced rinsing times and DIW consumption due to a DI water flow of up to 80 l/min resulting in faster basin filling and therefore faster operational readiness
- Low maintenance due to linear motor axis
- Intelligent safety control for collision avoidance in conjunction with an innovative sensor solution for detecting the process carrier
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AP&S Products in Use
If you have any questions or would like to contact us, we look forward to meeting you.
