NexAStep
The new, fully automatic, high-throughput line offers maximum automation and highest productivity.
NexAStep
AP&S PRODUCTS
Maximum Yield
The fully automated high-throughput NexAStep platform offers more functions in a more compact space for maximum yield.
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Main Benefits
- Wafer-friendly transport and maximum speed during empty runs thanks to a highly dynamic axis system
- Optimal use of the clean room due to compact design of the system and efficient arrangement of chemical supply, drains, receiver tanks and control cabinets in the module footprint
- Modular concept enables fast assembly, disassembly and conversion
- Uninterrupted production flow due to an integrated storage unit with up to 75 storage spaces
Processes
- Different wet cleaning proceses
- RCA
- Pre-diffusion
- Pre-metal
- Different etching processes, including oxide, nitride, polycrystalline, metals and silicides
Substrates
- Substrates
Wafers - Wafer material
Si, SiC, GaN - Wafer sizes
8″
Technical Features
- Up to 12 LMC carriers of 100 wafers (8/6 inch) with half spacing or 50 wafers (8/6 inch) with normal spacing for efficient processing
- Reduced process times possible due to increased process temperature of up to 170° C
- Reduced rinsing times and DIW consumption due to a DI water flow of up to 80 l/min resulting in faster basin filling and therefore faster operational readiness
- Low maintenance due to linear motor axis
- Intelligent safety control for collision avoidance in conjunction with an innovative sensor solution for detecting the process carrier