SpinEtcher
Proven system for wet processes with end-point detection for FEOL and BEOL processes
SpinEtcher
AP&S PRODUCTS
Endpoint Detection
This single wafer wet process system for wafer surface treatment and wafer thinning offers optimum results in FEOL and BEOL etching and cleaning.
Main Benefits
- Optimized CoC due to low chemical and water consumption
- Process safety according to highest safety level for chemicals
- Endpoint detection for highest reliability and process control:
1. Less over-processing time required to fully etch the layer (i.e. over-etching)
2. Less impact on other layers
3. Stable uniformity from wafer to wafer
4. Significant reduction of chemical consumption possible - Convenient handling and easy resizing, up to 5 media in one process tray
- Handling of thin wafers
- A plant demonstration in the AP&S DemoCenter is available.
Processes
- FEOL etching, BEOL etching and cleaning
- Wafer thinning
- Tension decrease
- Film removal and damage repair
Substrates
- Substrates
Wafers, MEMS, optoelectronics, photomasks, up to 9″ and square substrates - Wafer material
Si, SiC, GaN, GaAs, sapphire, glass - Wafer sizes
up to 12″
Technical Features
- Open cassette, SMIF pod, FOUP
- Easy configuration and flexible upgrading due to modular design
- Maximum safety for workers and plant according to highest safety standards
- Optimized plant footprint, easy feed
- No expensive space for the Chemicals Management System needed in the clean room, as it can be positioned outside
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AP&S Products in Use
If you have any questions or would like to contact us, we look forward to meeting you.
