Unique metal lift-off system with DMSO and Megasonic



Patented Lift-Off Process

This single wafer wet process system offers a patented lift-off process for unique process performance. Within a few seconds, the metal layer is completely lifted off without affecting the substrate or structures.

Main Benefits

  • Unique process performance without affecting substrate and structures
  • Use of DMSO (dimethyl sulfoxide), a non-critical EH&S substance (EU & US)
  • Complete lifting of the metal layer within < 30 seconds
  • Cost-efficient process: recovery of process chemicals and precious metals
  • Optimized process time with positive impact on overall throughput
  • A plant demonstration in the AP&S DemoCenter is available.


  • The AP&S metal lift-off solution is available for all types of metal layers, alloys and other protective coatings used in the semiconductor industry, such as Au, Ag, AlCu, etc.
  • Metal lift-off, PR-stripping


  • Substrates
    Wafers, MEMS, optoelectronics, photomasks, up to 9″ and square substrates
  • Wafer material
    Si, SiC, GaN, GaAs, sapphire, glass
  • Wafer sizes
    up to 12″

Technical Features

  • High safety for workers, environment and plant
  • MegaSonic agitation with field-proven MegaSonic system
  • Effective rinsing through optional high-pressure DIW
  • Rinsing with solvent (e.g. IPA) is available
  • Easy configuration and flexible upgrading due to modular design
  • Optimized plant footprint, easy feed


AP&S Products in Use

If you have any questions or would like to contact us, we look forward to meeting you.