Metal etching system with endpoint detection for top-level process control



Etching of Metal Layers

This single wafer system achieves optimum process results when etching metal layers of a wide variety of materials.

Main Benefits

  • Endpoint detection for highest reliability and process control:
    1. Less over-processing time required to fully etch the layer (i.e. over-etching)
    2. Less impact on other layers
    3. Stable uniformity from wafer to wafer
    4. Significant reduction of chemical consumption possible
  • Up to 6 different etching media
  • Backside protection of the wafers
  • A plant demonstration in the AP&S DemoCenter is available.


The SpinMetal system is suitable for etching metal layers of the following materials: nickel-chromium, nickel, copper, cobalt, aluminum, gold, titanium, titanium tungsten, silver, bismuth antimonide and others.


  • Substrates
    Wafers, MEMS, optoelectronics, photomasks, up to 9" and square substrates
  • Wafer material
    Si, SiC, GaN, GaAs, sapphire, glass
  • Wafer sizes
    up to 12″

Technical Features

  • Easy configuration and flexible upgrading due to modular design
  • Maximum safety for workers, plant and environment according to highest safety standards
  • Optimized plant footprint, easy feed
  • No expensive space for the Chemicals Management System required in the clean room, as this can be positioned outside. Link to the Mini Chemical Systems


AP&S Products in Use

If you have any questions or would like to contact us, we look forward to meeting you.