Cost-effective single wafer wet-chemical system for optimum RCA cleaning - available with one or two process chambers



RCA Cleaning

The SpinRCA single wafer wet process system is the perfect tool for efficient particle removal in microelectronics production.

Main Benefits

  • Optimized CoC due to low chemical and water consumption
  • Offers all advantages of single wafer processing in a small space
  • Maximum flexibility and high productivity due to fast and easy change of wafer sizes
  • A plant demonstration in the AP&S DemoCenter is available.


  • SC1 (Standard Clean 1)
  • SC2 (Standard Clean 2)
  • SPM (Piranha Cleaning)
  • dHF


  • Substrates
    Wafers, MEMS, optoelectronics, photomasks, up to 9" and square substrates
  • Wafer material
    Si, SiC, GaN, GaAs, sapphire, glass
  • Wafer sizes
    up to 12″

Technical Features

  • Easy configuration and flexible upgrading due to modular design
  • Maximum safety for workers, plant and environment according to highest safety standards
  • No expensive space for the Chemicals Management System in the clean room is required as it can be placed outside.
  • Available versions: MegaSonic system (MegPie/Meg nozzle)


AP&S Products in Use

If you have any questions or would like to contact us, we look forward to meeting you.