Tobias Bausch, CMO & CTO of AP&S, was asked about the company's technological innovations in an interview with Phil Alsop of Silicon Semiconductor Magazine.
The focus was on batch and single wafer processing equipment as well as production support equipment that deliver cost-effective, operationally optimized and sustainable customer solutions. The discussion also covered current industry challenges, including supply chain issues and skills shortages, as well as opportunities presented by emerging markets.
The interview with Phil Alsop was a great opportunity for Tobias Bausch to discuss the technologies and challenges of AP&S - thank you very much for the invitation!