Join us live for the AP&S presentation at the Technology Unites Global Summit on February 18, 2021 at 15:00


Even the title of the AP&S presentation makes it clear, this is exciting stuff: the journey and development history of SiC from 2015-2020 - "From single-wafer metal lift-off to metal etch to metal etch in the batch process".

Our speaker Stefan Zürcher, Team Leader Process Technology & Laboratory at AP&S, is looking forward to your participation. 

In this presentation, we will take you on an exciting journey around the topic of SiC. Using concrete practical examples, we will show you how wet process technology goes hand in hand with the customer - in this specific case with one of the world's leading semiconductor manufacturers. You will learn how wet process technology reacts flexibly to changes in customer production, responds to new challenges and develops concrete customer-specific solutions. Starting with a metal layer process, the optimized process Metal-Lift-Off with DMSO as a single wafer process, metal etching processes with end point detection (also single wafer) up to the etching process of the innovative substrate SiC in batch application. Both the changes in semiconductor manufacturing processes, such as process modification and throughput increase, and the solutions derived from them in the wet chemical process are presented. This is a success story resulting from the close cooperation between a semiconductor manufacturer and us, an expert in wet process equipment, and our well-known DEMO & R&D Center. Clear breakdowns of the different process data, parameters and conditions will give you a detailed overview of the development from 2015 to 2020. Be there and experience the fascinating world of wet process technology! Click here to go to the event: SMART Mobility Forum (