SpinMask
Proven system for cleaning and etching of all common types of photomasks
SpinMask
AP&S PRODUCTS
Mask Processing
SpinMask is a wet chemical cleaning, etching and resist stripping system developed for photomasks that offers high flexibility and productivity.
Main Benefits
- Maximum flexibility in setting the recipe parameters according to the different mask types
- High-quality cleaning results leading to a longer service life of the mask
- Extremely versatile, as this wet process equipment is suitable for a wide range of masks and other substrates
- High flexibility and productivity due to quick and easy change of mask size
- Optimized CoC due to low chemical and water consumption
- A plant demonstration in the AP&S DemoCenter is available.
Processes
- Photomask cleaning
- Photomask etching
- Photomask resist strip
Substrates
- Substrates
Masks - Wafer material
Si, SiC, GaN, GaAs, sapphire, glass - Wafer sizes
up to 9″
Technical Features
- Easy configuration and flexible upgrading due to modular design
- Maximum safety for workers, plant and environment according to highest safety standards
- Optimized plant footprint, easy feed
- No expensive space for the Chemicals Management System needed in the clean room, as it can be positioned outside
- Available versions: high pressure, single-sided brush, SPM, SC1, dNH4OH, CO2 ionization, MegaSonic system (MegPie/Meg nozzle)
