Proven system for cleaning and etching of all common types of photomasks



Mask Processing

SpinMask is a wet chemical cleaning, etching and resist stripping system developed for photomasks that offers high flexibility and productivity.

Main Benefits

  • Maximum flexibility in setting the recipe parameters according to the different mask types
  • High-quality cleaning results leading to a longer service life of the mask
  • Extremely versatile, as this wet process equipment is suitable for a wide range of masks and other substrates
  • High flexibility and productivity due to quick and easy change of mask size
  • Optimized CoC due to low chemical and water consumption
  • A plant demonstration in the AP&S DemoCenter is available.


  • Photomask cleaning
  • Photomask etching
  • Photomask resist strip


  • Substrates
  • Wafer material
    Si, SiC, GaN, GaAs, sapphire, glass
  • Wafer sizes
    up to 9″

Technical Features

  • Easy configuration and flexible upgrading due to modular design
  • Maximum safety for workers, plant and environment according to highest safety standards
  • Optimized plant footprint, easy feed
  • No expensive space for the Chemicals Management System needed in the clean room, as it can be positioned outside
  • Available versions: high pressure, single-sided brush, SPM, SC1, dNH4OH, CO2 ionization, MegaSonic system (MegPie/Meg nozzle)


AP&S Products in Use

If you have any questions or would like to contact us, we look forward to meeting you.